Turner Research Group

 
 

 

Journal Publications

Printing and mechanical characterization of cellulose nanofibril materials
L.M. Mariani, W.R. Johnson, J.M. Considine and K.T. Turner, Cellulose, 26, 2639-2651 (2019). http://doi.org/10.1007/s10570-019-02247-w

Design and characterization of a hydrodynamically confined microflow device for applying controlled loads to investigate single-cell mechanics
K.V. Christ, C. Park, K.S. Masters and K.T. Turner, Microfluidics and Nanofluidics, 23, (2019). http://doi.org/10.1007/s10404-019-2210-5

Ultrasensitive, Mechanically Responsive Optical Metasurfaces via Strain Amplification
W.X. Chen, W.J. Liu, Y.L. Jiang, M.L. Zhang, N.X. Song, N.J. Greybush, J.C. Guo, A.K. Estep, K.T. Turner, R. Agarwal and C.R. Kagan, ACS Nano, 12, 10683-10692 (2018). http://doi.org/10.1021/acsnano.8b04889

Shear Adhesion of Tapered Nanopillar Arrays
Y. Cho, H.K. Minsky, Y.J. Jiang, K.Y. Yin, K.T. Turner and S. Yang, ACS Applied Materials & Interfaces, 10, 11391-11397 (2018). http://doi.org/10.1021/acsami.8b02303

Toughening Nanoparticle Films via Polymer Infiltration and Confinement
Y.J. Jiang, J.L. Hor, D. Lee and K.T. Turner, ACS Applied Materials & Interfaces, 10, 44011-44017 (2018). http://doi.org/10.1021/acsami.8b15027

Dynamically Tunable Dry Adhesion via Subsurface Stiffness Modulation
M. Tatari, A.M. Nasab, K.T. Turner and W.L. Shan, Advanced Materials Interfaces, 5, (2018). http://doi.org/10.1002/admi.201800321

Rough Adhesive Hydrogels (RAd gels) for Underwater Adhesion
L.C. Bradley, N.D. Bade, L.M. Mariani, K.T. Turner, D. Lee and K.J. Stebe, ACS Applied Materials & Interfaces, 9, 27409-27413 (2017). http://doi.org/10.1021/acsami.7b08916

Smoothly varying in-plane stiffness heterogeneity evaluated under uniaxial tensile stress
J.M. Considine, F. Pierron, K.T. Turner, P. Lava and X. Tang, Strain, 53, (2017). http://doi.org/10.1111/str.12237

Structure-property relationships from universal signatures of plasticity in disordered solids
E.D. Cubuk, R.J.S. Ivancic, S.S. Schoenholz, D.J. Strickland, A. Basu, Z.S. Davidson, J. Fontaine, J.L. Hor, Y.R. Huang, Y. Jiang, N.C. Keim, K.D. Koshigan, J.A. Lefever, T. Liu, X.G. Ma, D.J. Magagnosc, E. Morrow, C.P. Ortiz, J.M. Rieser, A. Shavit, T. Still, Y. Xu, Y. Zhang, K.N. Nordstrom, P.E. Arratia, R.W. Carpick, D.J. Durian, Z. Fakhraai, D.J. Jerolmack, D. Lee, J. Li, R. Riggleman, K.T. Turner, A.G. Yodh, D.S. Gianola and A.J. Liu, Science, 358, 1033-1037 (2017). http://doi.org/10.1126/science.aai8830

Nanoporous Polymer-Infiltrated Nanoparticle Films with Uniform or Graded Porosity via Undersaturated Capillary Rise Infiltration
J.L. Hor, Y.J. Jiang, D.J. Ring, R.A. Riggleman, K.T. Turner and D. Lee, ACS Nano, 11, 3229-3236 (2017). http://doi.org/10.1021/acsnano.7b00298

Correcting for Tip Geometry Effects in Molecular Simulations of Single-Asperity Contact
Y.J. Jiang, J.A. Harrison, J.D. Schall, K.E. Ryan, R.W. Carpick and K.T. Turner, Tribology Letters, 65, (2017). http://doi.org/10.1007/s11249-017-0857-1

Enhancing the stiffness of vertical graphene sheets through ion beam irradiation and fluorination
C. Lin, K. Davami, Y.J. Jiang, J. Cortes, M. Munther, M. Shaygan, H. Ghassemi, J.T. Robinson, K.T. Turner and I. Bargatin, Nanotechnology, 28, (2017). http://doi.org/10.1088/1361-6528/aa75ac

Tribochemical Wear of Diamond-Like Carbon-Coated Atomic Force Microscope Tips
J.J. Liu, Y.J. Jiang, D.S. Grierson, K. Sridharan, Y.C. Shao, T.D.B. Jacobs, M.L. Falk, R.W. Carpick and K.T. Turner, ACS Applied Materials & Interfaces, 9, 35341-35348 (2017). http://doi.org/10.1021/acsami.7b08026

Composite Microposts with High Dry Adhesion Strength
H.K. Minsky and K.T. Turner, ACS Applied Materials & Interfaces, 9, 18322-18327 (2017). http://doi.org/10.1021/acsami.7b01491

Compression and recovery of carbon nanotube forests described as a phase transition
X. Liang, J. Shin, D. Magagnosc, Y. Jiang, S.J. Park, A.J. Hart, K.T. Turner, D.S. Gianola, and P.K. Purohit, International Journal of Solids and Structures, 122, 196-209 (2017). http://doi.org/10.1016/j.ijsolstr.2017.06.025

Multibond Model of Single-Asperity Tribochemical Wear at the Nanoscale
Y.C. Shao, T.D.B. Jacobs, Y.J. Jiang, K.T. Turner, R.W. Carpick and M.L. Falk, ACS Applied Materials & Interfaces, 9, 35333-35340 (2017). http://doi.org/10.1021/acsami.7b08023

Hybrid Surface Patterns Mimicking the Design of the Adhesive Toe Pad of Tree Frog
L.J. Xue, B. Sanz, A. Luo, K.T. Turner, X. Wang, D. Tan, R. Zhang, H. Du, M. Steinhart, C. Mijangos, M. Guttmann, M. Kappl and A. del Campo, ACS Nano, 11, 9711-9719 (2017). http://doi.org/10.1021/acsnano.7b04994

Spontaneous Periodic Delamination of Thin Films To Form Crack-Free Metal and Silicon Ribbons with High Stretchability
Q.T. Zhang, Y.C. Tang, M. Hajfathalian, C.X. Chen, K.T. Turner, D.A. Dikin, G.J. Lin and J. Yin, ACS Applied Materials & Interfaces, 9, 44938-44947 (2017). http://doi.org/10.1021/acsami.7b15693

Tuning the mechanical properties of vertical graphene sheets through atomic layer deposition
K. Davami, Y.J. Jiang, J. Cortes, C. Lin, M. Shaygan, K.T. Turner and I. Bargatin, Nanotechnology, 27, (2016). http://doi.org/10.1088/0957-4484/27/15/155701

Modification of mechanical properties of vertical graphene sheets via fluorination
K. Davami, Y.J. Jiang, C. Lin, J. Cortes, J.T. Robinson, K.T. Turner and I. Bargatin, RSC Advances, 6, 11161-11166 (2016). http://doi.org/10.1039/c5ra25068d

Rolling-based direct-transfer printing: A process for large-area transfer of micro- and nanostructures onto flexible substrates
D.S. Grierson, F.S. Flack, M.G. Lagally and K.T. Turner, Journal of Applied Physics, 120, (2016). http://doi.org/10.1063/1.4961407

Measurement of the strength and range of adhesion using atomic force microscopy
Y.J. Jiang and K.T. Turner, Extreme Mechanics Letters, 9, 119-126 (2016). http://doi.org/10.1016/j.eml.2016.05.013

Design, analysis, and characterization of stress-engineered 3D microstructures comprised of PECVD silicon oxide and nitride
C.H. Pi and K.T. Turner, Journal of Micromechanics and Microengineering, 26, (2016). http://doi.org/10.1088/0960-1317/26/6/065010

Models to relate wafer geometry measurements to in-plane distortion of wafers
K.T. Turner, P. Vukkadala and J.K. Sinha, Journal of Micro-Nanolithography MEMS and MOEMS, 15, (2016). http://doi.org/10.1117/1.jmm.15.2.021404

Orthogonal Control of Stability and Tunable Dry Adhesion by Tailoring the Shape of Tapered Nanopillar Arrays
Y. Cho, G. Kim, Y. Cho, S.Y. Lee, H. Minsky, K.T. Turner, D.S. Gianola and S. Yang, Advanced Materials, 27, 7788-7793 (2015). http://doi.org/10.1002/adma.201503347

Wear biomechanics in the slicing dentition of the giant horned dinosaur Triceratops
G.M. Erickson, M.A. Sidebottom, D.I. Kay, K.T. Turner, N. Ip, M.A. Norell, W.G. Sawyer and B.A. Krick, Science Advances, 1, (2015). http://doi.org/10.1126/sciadv.1500055

Polymer nanocomposite films with extremely high nanoparticle loadings via capillary rise infiltration (CaRI)
Y.R. Huang, Y.J. Jiang, J.L. Hor, R. Gupta, L. Zhang, K.J. Stebe, G. Feng, K.T. Turner and D. Lee, Nanoscale, 7, 798-805 (2015). http://doi.org/10.1039/c4nr05464d

Achieving enhanced and tunable adhesion via composite posts
H.K. Minsky and K.T. Turner, Applied Physics Letters, 106, (2015). http://doi.org/10.1063/1.4921423

Facile Fabrication of Ordered Crystalline- Semiconductor Microstructures on Compliant Substrates
F. Cavallo, K.T. Turner and M.G. Lagally, Advanced Functional Materials, 24, 1730-1737 (2014). http://doi.org/10.1002/adfm.201303165

General Anisotropy Identification of Paperboard with Virtual Fields Method
J.M. Considine, F. Pierron, K.T. Turner and D.W. Vahey, Experimental Mechanics, 54, 1395-1410 (2014). http://doi.org/10.1007/s11340-014-9903-1

Thin film heat flux sensors fabricated on copper substrates for thermal measurements in microfluidic environments
B.A. Jasperson, J. Schmale, W.L. Qu, F.E. Pfefferkorn and K.T. Turner, Journal of Micromechanics and Microengineering, 24, (2014). http://doi.org/10.1088/0960-1317/24/12/125018

Flat punch adhesion: transition from fracture-based to strength-limited pull-off
Y.J. Jiang, D.S. Grierson and K.T. Turner, Journal of Physics D-Applied Physics, 47, (2014). http://doi.org/10.1088/0022-3727/47/32/325301

Interface mechanics of adhesiveless microtransfer printing processes
H.J. Kim-Lee, A. Carlson, D.S. Grierson, J.A. Rogers and K.T. Turner, Journal of Applied Physics, 115, (2014). http://doi.org/10.1063/1.4870873

Simulated Adhesion between Realistic Hydrocarbon Materials: Effects of Composition, Roughness, and Contact Point
K.E. Ryan, P.L. Keating, T.D.B. Jacobs, D.S. Grierson, K.T. Turner, R.W. Carpick and J.A. Harrison, Langmuir, 30, 2028-2037 (2014). http://doi.org/10.1021/la404342d

Atomic-Scale Wear of Amorphous Hydrogenated Carbon during Intermittent Contact: A Combined Study Using Experiment, Simulation, and Theory
V. Vahdat, K.E. Ryan, P.L. Keating, Y.J. Jiang, S.P. Adiga, J.D. Schal, K.T. Turner, J.A. Harrison and R.W. Carpick, ACS Nano, 8, 7027-7040 (2014). http://doi.org/10.1021/nn501896e

Determining local residual stresses from high resolution wafer geometry measurements
J. Gong, P. Vukkadala, J.K. Sinha and K.T. Turner, Journal of Vacuum Science & Technology B, 31, (2013). http://doi.org/10.1116/1.4818884

Adhesion of nanoscale asperities with power-law profiles
D.S. Grierson, J.J. Liu, R.W. Carpick and K.T. Turner, Journal of the Mechanics and Physics of Solids, 61, 597-610 (2013). http://doi.org/10.1016/j.jmps.2012.09.003

The Effect of Atomic-Scale Roughness on the Adhesion of Nanoscale Asperities: A Combined Simulation and Experimental Investigation
T.D.B. Jacobs, K.E. Ryan, P.L. Keating, D.S. Grierson, J.A. Lefever, K.T. Turner, J.A. Harrison and R.W. Carpick, Tribology Letters, 50, 81-93 (2013). http://doi.org/10.1007/s11249-012-0097-3

Role of wafer geometry in wafer chucking
K.T. Turner, R. Ramkhalawon and J.K. Sinha, Journal of Micro-Nanolithography MEMS and MOEMS, 12, (2013). http://doi.org/10.1117/1.jmm.12.2.023007

Mechanics of Interaction and Atomic-Scale Wear of Amplitude Modulation Atomic Force Microscopy Probes
V. Vahdat, D.S. Grierson, K.T. Turner and R.W. Carpick, ACS Nano, 7, 3221-3235 (2013). http://doi.org/10.1021/nn305901n

Determining the Elastic Modulus of Compliant Thin Films Supported on Substrates from Flat Punch Indentation Measurements
M.J. Wald, J.M. Considine and K.T. Turner, Experimental Mechanics, 53, 931-941 (2013). http://doi.org/10.1007/s11340-012-9705-2

An analytical model for shear-enhanced adhesiveless transfer printing
H.Y. Cheng, J. Wu, Q.M. Yu, H.J. Kim-Lee, A. Carlson, K.T. Turner, K.C. Hwang, Y.G. Huang and J.A. Rogers, Mechanics Research Communications, 43, 46-49 (2012). http://doi.org/10.1016/j.mechrescom.2012.02.011

Evaluation of strength-controlling defects in paper by stress concentration analyses
J.M. Considine, D.W. Vahey, J.W. Evans, K.T. Turner and R.E. Rowlands, Journal of Composite Materials, 46, 1323-1334 (2012). http://doi.org/10.1177/0021998311418262

Advances in Manufacturing of Molded Tips for Scanning Probe Microscopy
N. Moldovan, Z.T. Dai, H.J. Zeng, J.A. Carlisle, T.D.B. Jacobs, V. Vahdat, D.S. Grierson, J.J. Liu, K.T. Turner and R.W. Carpick, Journal of Microelectromechanical Systems, 21, 431-442 (2012). http://doi.org/10.1109/jmems.2011.2174430

Relationship between localized wafer shape changes induced by residual stress and overlay errors
K.T. Turner, S. Veeraraghavan and J.K. Sinha, Journal of Micro-Nanolithography MEMS and MOEMS, 11, (2012). http://doi.org/10.1117/1.jmm.11.1.013001

Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly
A. Carlson, H.J. Kim-Lee, J. Wu, P. Elvikis, H.Y. Cheng, A. Kovalsky, S. Elgan, Q.M. Yu, P.M. Ferreira, Y.G. Huang, K.T. Turner and J.A. Rogers, Applied Physics Letters, 98, (2011). http://doi.org/10.1063/1.3605558

"Soft Si": Effective Stiffness of Supported Crystalline Nanomembranes
F. Cavallo, D.S. Grierson, K.T. Turner and M.G. Lagally, ACS Nano, 5, 5400-5407 (2011). http://doi.org/10.1021/nn200461g

Effect of Inorganic Fillers in Paper on the Adhesion of Pressure-Sensitive Adhesives
W.X. Chen, X.Y. Tang, J. Considine and K.T. Turner, Journal of Adhesion Science and Technology, 25, 581-596 (2011). http://doi.org/10.1163/016942410x525830

Design of hydrodynamically confined microfluidics: controlling flow envelope and pressure
K.V. Christ and K.T. Turner, Lab on a Chip, 11, 1491-1501 (2011). http://doi.org/10.1039/c0lc00416b

Impact of Wafer Geometry on CMP for Advanced Nodes
P. Vukkadala, K.T. Turner and J.K. Sinha, Journal of the Electrochemical Society, 158, H1002-H1009 (2011). http://doi.org/10.1149/1.3615988

Methods to Measure the Strength of Cell Adhesion to Substrates
K.V. Christ and K.T. Turner, Journal of Adhesion Science and Technology, 24, 2027-2058 (2010). http://doi.org/10.1163/016942410x507911

Measurement of single-cell adhesion strength using a microfluidic assay
K.V. Christ, K.B. Williamson, K.S. Masters and K.T. Turner, Biomedical Microdevices, 12, 443-455 (2010). http://doi.org/10.1007/s10544-010-9401-x

Comparison of Micro-Pin-Fin and Microchannel Heat Sinks Considering Thermal-Hydraulic Performance and Manufacturability
B.A. Jasperson, Y. Jeon, K.T. Turner, F.E. Pfefferkorn and W.L. Qu, Ieee Transactions on Components and Packaging Technologies, 33, 148-160 (2010). http://doi.org/10.1109/tcapt.2009.2023980

Preventing Nanoscale Wear of Atomic Force Microscopy Tips Through the Use of Monolithic Ultrananocrystalline Diamond Probes
J. Liu, D.S. Grierson, N. Moldovan, J. Notbohm, S. Li, P. Jaroenapibal, S.D. O'Connor, A.V. Sumant, N. Neelakantan, J.A. Carlisle, K.T. Turner and R.W. Carpick, Small, 6, 1140-1149 (2010). http://doi.org/10.1002/smll.200901673

Method for Characterizing Nanoscale Wear of Atomic Force Microscope Tips
J.J. Liu, J.K. Notbohm, R.W. Carpick and K.T. Turner, ACS Nano, 4, 3763-3772 (2010). http://doi.org/10.1021/nn100246g

Ordering of nanostressors on free-standing silicon nanomembranes and nanoribbons
C.S. Ritz, H.J. Kim-Lee, D.M. Detert, M.M. Kelly, F.S. Flack, D.E. Savage, Z. Cai, P.G. Evans, K.T. Turner and M.G. Lagally, New Journal of Physics, 12, (2010). http://doi.org/10.1088/1367-2630/12/10/103011

3D elastomeric scaffolds fabricated by casting in micro end milled moulds
J. Vivanco, B. Smith, A. Blake, J.C. Williams, K.T. Turner and H. Ploeg, Journal of Biomimetics, Biomaterials, and Tissue Engineering, 9, 17-23 (2010). http://doi.org/10.4028/www.scientific.net/JBBTE.9.17

Control of Three-Dimensional Island Growth with Mechanically Responsive Single-Crystal Nanomembrane Substrates
H.J. Kim-Lee, D.E. Savage, C.S. Ritz, M.G. Lagally and K.T. Turner, Physical Review Letters, 102, (2009). http://doi.org/10.1103/PhysRevLett.102.226103

Friction laws at the nanoscale
Y.F. Mo, K.T. Turner and I. Szlufarska, Nature, 457, 1116-1119 (2009). http://doi.org/10.1038/nature07748

Predicting distortions and overlay errors due to wafer deformation during chucking on lithography scanners
K.T. Turner, S. Veeraraghavan and J.K. Sinha, Journal of Micro-Nanolithography MEMS and MOEMS, 8, (2009). http://doi.org/10.1117/1.3247857

A chevron specimen for the measurement of mixed-mode interface toughness of wafer bonds
R. Tadepalli and K.T. Turner, Engineering Fracture Mechanics, 75, 1310-1319 (2008). http://doi.org/10.1016/j.engfracmech.2007.07.009

Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds
R. Tadepalli, K.T. Turner and C.V. Thompson, Acta Materialia, 56, 438-447 (2008). http://doi.org/10.1016/j.actamat.2007.10.016

Mixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test
R. Tadepalli, K.T. Turner and C.V. Thompson, Journal of the Mechanics and Physics of Solids, 56, 707-718 (2008). http://doi.org/10.1016/j.jmps.2007.07.016

Accurate characterization of wafer bond toughness with the double cantilever specimen
K.T. Turner and S.M. Spearing, Journal of Applied Physics, 103, (2008). http://doi.org/10.1063/1.2828156

Simulating fluid flow in lithographically directed, evaporation driven self-assembly systems
J.J. Dyreby, G.F. Nellis and K.T. Turner, Microelectronic Engineering, 84, 1519-1522 (2007). http://doi.org/10.1016/j.mee.2007.01.253

Viscoelasticity of the human red blood cell
M. Puig-De-Morales-Marinkovic, K.T. Turner, J.P. Butler, J.J. Fredberg and S. Suresh, American Journal of Physiology-Cell Physiology, 293, C597-C605 (2007). http://doi.org/10.1152/ajpcell.00562.2006

Analysis of Coulomb and Johnsen-Rahbek electrostatic chuck performance for extreme ultraviolet lithography
M.R. Sogard, A.R. Mikkelson, M. Nataraju, K.T. Turner and R.L. Engelstad, Journal of Vacuum Science & Technology B, 25, 2155-2161 (2007). http://doi.org/10.1116/1.2798724

Submicron aligned wafer bonding via capillary forces
M.R. Tupek and K.T. Turner, Journal of Vacuum Science & Technology B, 25, 1976-1981 (2007). http://doi.org/10.1116/1.2787866

Electrostatic chucking for extreme ultraviolet lithography: Simulations and experiments
M. Nataraju, J. Sohn, S. Veeraraghavan, A.R. Mikkelson, K.T. Turner, R.L. Engelstad, C.K. Van Peski and K.J. Orvek, Journal of Vacuum Science & Technology B, 24, 2834-2839 (2006). http://doi.org/10.1116/1.2388967

Distortion of chucked extreme ultraviolet reticles from entrapped particles
V. Ramaswamy, R.L. Engelstad, K.T. Turner, A.R. Mikkelson and S. Veeraraghavan, Journal of Vacuum Science & Technology B, 24, 2829-2833 (2006). http://doi.org/10.1116/1.2375078

Mechanics of direct wafer bonding
K.T. Turner and S.M. Spearing, Proceedings of the Royal Society A-Mathematical Physical and Engineering Sciences, 462, 171-188 (2006). http://doi.org/10.1098/rspa.2005.1571

Effect of nanotopography in direct wafer bonding: Modeling and measurements
K.T. Turner, S.M. Spearing, W.A. Baylies, M. Robinson and R. Smythe, IEEE Transactions on Semiconductor Manufacturing, 18, 289-296 (2005). http://doi.org/10.1109/tsm.2005.845009

Fabrication of a high frequency piezoelectric microvalve
H.Q. Li, D.C. Roberts, J.L. Steyn, K.T. Turner, O. Yaglioglu, N.W. Hagood, S.M. Spearing and M.A. Schmidt, Sensors and Actuators A-Physical, 111, 51-56 (2004). http://doi.org/10.1016/j.sna.2003.10.013

Structural design considerations for micromachined solid-oxide fuel cells
V.T. Srikar, K.T. Turner, T.Y.A. Ie and S.M. Spearing, Journal of Power Sources, 125, 62-69 (2004). http://doi.org/10.1016/j.jpowsour.2003.07.002

Mechanics of wafer bonding: Effect of clamping
K.T. Turner, M.D. Thouless and S.M. Spearing, Journal of Applied Physics, 95, 349-355 (2004). http://doi.org/10.1063/1.1629776

Characterization of silicon wafer bonding for power MEMS applications
A.A. Ayon, X. Zhang, K.T. Turner, D.W. Choi, B. Miller, S.F. Nagle and S.M. Spearing, Sensors and Actuators A-Physical, 103, 1-8 (2003). http://doi.org/10.1016/s0924-4247(02)00329-1

A high-frequency, high-stiffness piezoelectric actuator for microhydraulic applications
D.C. Roberts, H.Q. Li, J.L. Steyn, K.T. Turner, R. Mlcak, L. Saggere, S.M. Spearing, M.A. Schmidt and N.W. Hagood, Sensors and Actuators A-Physical, 97-8, 620-631 (2002). http://doi.org/10.1016/s0924-4247(01)00841-x

Modeling of direct wafer bonding: Effect of wafer bow and etch patterns
K.T. Turner and S.M. Spearing, Journal of Applied Physics, 92, 7658-7666 (2002). http://doi.org/10.1063/1.1521792

Tensile testing of polysilicon
W.N. Sharpe, K.T. Turner and R.L. Edwards, Experimental Mechanics, 39, 162-170 (1999). http://doi.org/10.1007/bf02323548


Book Chapters

Design of hydrodynamically confined microfluidic systems
C. Park, K.T. Turner. Open-Space Microfluidics. Eds. Emmanuel Delamarche and Govind V. Kaigala. Wiley. (2018).

Understanding the tip-sample contact: An overview of contact mechanics at the nanoscale
T.D.B. Jacobs, C.M. Mate, K.T. Turner, and R.W. Carpick. Scanning Probe Microscopy for Industrial Applications: Nanomechanical Characterization. Ed. D. G. Yablon. Wiley. (2013).

 

 

 

Copyright Kevin T. Turner 2005-2019