Mechanics plays a central role in semiconductor manufacturing processes, including wafer bonding and layer transfer for heterogenous integration and advanced lithography processes. Below are a selection of papers that describe some of our work in this area:
Wafer Bonding
K.T. Turner, “Mechanics of wafer bonding and layer transfer processes,” ECS Transactions (2012 ECS Meeting, Semiconductor Wafer Bonding 12: Science, Technology, and Applications), 50, 201-6 (2013). (invited) https://doi.org/10.1149/05007.0201ecst
N. Podjue, W. Kerr, and K.T. Turner, “Inspection of bonded interfaces using scanning infrared interferometry,” in ECS Transactions(2010 ECS Meeting, Semiconductor Wafer Bonding 11: Science, Technology, and Applications), 33, 537-41 (2010). https://doi.org/10.1149/1.3483545
D.S. Grierson and K.T. Turner, “Characterization of hysteresis of surface energy in room-temperature direct bonding processes,” in ECS Transactions (2010 ECS Meeting, Semiconductor Wafer Bonding 11: Science, Technology, and Applications), 33, 573-80 (2010). https://doi.org/10.1149/1.3483549
K.T. Turner, “Fabricating strained silicon substrates using mechanical deformation during wafer bonding,” in ECS Transactions (2008 ECS Meeting, Semiconductor Wafer Bonding 10: Science, Technology, and Applications), 16, 321-8 (2008). https://doi.org/10.1149/1.2982884
R.A. Allen, J.C. Marshall, W.A. Baylies, D.T. Read, F. Delrio, K.T. Turner, M. Bernasch, and J. Bagdahn, “A standard Method for measuring wafer bond strength for MEMS applications,” in ECS Transactions (2008 ECS Meeting, Semiconductor Wafer Bonding 10: Science, Technology, and Applications), 16(8), 449-55 (2008). https://doi.org/10.1149/1.2982899
R. Tadepalli and K.T. Turner, “A chevron specimen for the measurement of mixed-mode interface toughness of wafer bonds,” Engineering Fracture Mechanics, 75, 1310-19 (2008). https://doi.org/10.1016/j.engfracmech.2007.07.009
R. Tadepalli, K.T. Turner, and C.V. Thompson, “Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds,” Acta Materialia, 56, 438-47 (2008). https://doi.org/10.1016/j.actamat.2007.10.016
K.T. Turner and S.M. Spearing, “Accurate characterization of wafer bond toughness with the double cantilever specimen,” Journal of Applied Physics, 103, 013514 (2008). https://doi.org/10.1063/1.2828156
M.R. Tupek and K.T. Turner, “Sub-micron aligned wafer bonding via capillary forces,” Journal of Vacuum Science and Technology B, 25, 1976-81 (2007). https://doi.org/10.1116/1.2787866
K.T. Turner and S.M. Spearing, “Mechanics of direct wafer bonding,” Proceedings of the Royal Society of London A, 462, 171-88 (2006). https://doi.org/10.1098/rspa.2005.1571
K.T. Turner, S.M. Spearing, W.A. Baylies, M. Robinson, and R. Smythe, “Effect of nanotopography in direct wafer bonding: Modeling and measurements,” IEEE Transactions on Semiconductor Manufacturing, 18, 289-96 (2005). https://doi.org/10.1109/TSM.2005.845009
K.T. Turner, S.M. Spearing, P. Hester, J. Sinha, and W.A. Baylies, “Effect of wafer-scale shape variations and mounting in wafer bonding,” in Semiconductor Wafer Bonding VIII: Science, Technology, and Applications (2005 ECS Meeting), PV 2005-02, 270-9 (2005).
K.T. Turner, M.D. Thouless, and S.M. Spearing, “Mechanics of wafer bonding: Effect of clamping,” Journal of Applied Physics, 95, 349-55 (2004). https://doi.org/10.1063/1.1629776
K.T. Turner and S.M. Spearing, “Experimental validation of mechanics-based process models for direct wafer bonding,” in Technical Digest of Hilton Head ’04: Solid-State Sensor, Actuator, and Microsystems Workshop, 196-9 (2004). https://doi.org/10.31438/trf.hh2004.53
K.T. Turner and S.M. Spearing, “Modeling of direct wafer bonding: Effect of wafer bow and etch patterns,” Journal of Applied Physics, 92, 7658-66 (2002). https://doi.org/10.1063/1.1521792
K.T. Turner, A.A. Ayon, D. Choi, B. Miller, and S.M. Spearing, “Characterization of silicon fusion bonds using a four-point bend specimen,” in Materials Research Society (MRS) Online Proceedings Library, 657, 63 (2000). https://doi.org/10.1557/PROC-657-EE6.3
K.T. Turner and S.M. Spearing, “Modeling of direct wafer bonding: Effect of wafer bow and etch patterns,” Journal of Applied Physics, 92, 7658-66 (2002). https://doi.org/10.1063/1.1521792
K.T. Turner, A.A. Ayon, D. Choi, B. Miller, and S.M. Spearing, “Characterization of silicon fusion bonds using a four-point bend specimen,” in Materials Research Society (MRS) Online Proceedings Library, 657, 63 (2000). https://doi.org/10.1557/PROC-657-EE6.3
Microtransfer Printing and Layer Transfer
A. Luo and K.T. Turner, “Mechanics of crack path selection in microtransfer printing: Challenges and opportunities for process control,” Journal of the Mechanics and Physics of Solids, 143, 104066 (2020). https://doi.org/10.1016/j.jmps.2020.104066
S. Kim, Y. Jiang, K. Towell-Thompson, M.S.H. Boutilier, N. Nayakanti, C. Cao, C. Chen, C. Jacob, H. Zhao, K.T. Turner, and A.J. Hart, “Soft nanocomposite electroadhesives for digital micro-and nanotransfer printing,” Science Advances, 5, eaax4790 (2019). https://doi.org/10.1126/sciadv.aax4790
H.K. Minsky and K.T. Turner, “Composite microposts with high dry adhesion strength,” ACS Applied Materials and Interfaces, 9, 18322-27 (2017). https://doi.org/10.1021/acsami.7b01491
D.S. Grierson, F.S. Flack, M.G. Lagally, and K.T. Turner, “Rolling-based direct-transfer printing: A process for large-area transfer of micro-and nanostructures onto flexible substrates,” Journal of Applied Physics, 120, 093103 (2016). https://doi.org/10.1063/1.4961407
H.J. Kim-Lee, A. Carlson, D.S. Grierson, J.A. Rogers, and K.T. Turner, “Interface mechanics of adhesiveless microtransfer printing processes,” Journal of Applied Physics, 115, 143513 (2014). https://doi.org/10.1063/1.4870873
F. Cavallo, K.T. Turner, and M.G. Lagally, “Facile fabrication of ordered crystalline-semiconductor microstructures on compliant substrates,” Advanced Functional Materials, 24, 1730-37 (2014). https://doi.org/10.1002/adfm.201303165
H. Cheng, J. Wu, Q. Yu, H.-J. Kim-Lee, A. Carlson, K. T. Turner, K.-C. Hwang, Y. Huang, and J.A. Rogers, “An analytical model for shear-enhanced adhesiveless transfer printing,” Mechanics Research Communications, 43, 46-9 (2012). https://doi.org/10.1016/j.mechrescom.2012.02.011
F. Cavallo, D.S. Grierson, K.T. Turner, and M.G. Lagally, “’Soft Si: Effective stiffness of supported crystalline nanomembranes,” ACS Nano, 5, 5400-7 (2011). https://doi.org/10.1021/nn200461g
A. Carlson, H.J. Kim-Lee, J. Wu, P. Elvikis, H.Y. Cheng, A. Kovalsky, P.M. Ferreira, Y.G. Huang, K.T. Turner, and J.A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Applied Physics Letters, 98, 264104 (2011). https://doi.org/10.1063/1.3605558
Advanced Lithography
K.T. Turner, P. Vukkadala, and J.K. Sinha, “Models to relate wafer geometry measurements to in-plane distortion of wafers,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 15, 021404 (2016). https://doi.org/10.1117/1.jmm.15.2.021404
K.T. Turner, R. Ramkhalawon, and J.K. Sinha, “The role of wafer geometry in wafer chucking,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 12, 023007 (2013). https://doi.org/10.1117/1.jmm.12.2.023007
J. Gong, P. Vukkadala, J. Sinha, and K.T. Turner, “Determining local residual stresses from high resolution wafer geometry measurements,” Journal of Vacuum Science and Technology B, 31, 051205 (2013). https://doi.org/10.1116/1.4818884
K.T. Turner, S. Veeraraghavan, and, J.K. Sinha, “Relationship between localized wafer shape changes induced by residual stress and overlay errors,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 11, 013001 (2012). https://doi.org/10.1117/1.jmm.11.1.013001
V. Ramaswamy, R. L. Engelstad, K.T. Turner, A. R. Mikkelson, and S. Veeraraghavan, “Distortion of chucked extreme ultraviolet reticles from entrapped particles,” Journal of Vacuum Science and Technology B, 24, 2829-33 (2006). https://doi.org/10.1116/1.2375078
M. Nataraju, J. Sohn, S. Veeraraghavan, A. Mikkelson, K.T. Turner, R. Engelstad, C. Van Peski, and K.J. Orvek, “Electrostatic chucking for extreme ultraviolet lithography: Simulations and experiments,” Journal of Vacuum Science and Technology B, 24, 2834-39 (2006). https://doi.org/10.1116/1.2388967