Turner Researh Group Heading
 
 

PUBLICATIONS IN REFEREED JOURNALS

  1. W.N. Sharpe Jr., K.T. Turner, and R.L. Edwards, “Tensile testing of polysilicon,” Experimental Mechanics, 39, 162-70 (1999).

  2. D.C. Roberts, H. Li, J. Steyn, K.T. Turner, R. Mlcak, L. Saggere, S.M. Spearing, M.A. Schmidt, and N.W. Hagood, “A high frequency, high stiffness piezoelectric actuator for microhydraulic applications,” Sensors and Actuators A, 97-98, 620-31 (2002).

  3. K.T. Turner and S.M. Spearing, “Modeling of direct wafer bonding: Effect of wafer bow and etch patterns,” Journal of Applied Physics, 92, 7658-66 (2002).

  4. A.A. Ayon, X. Zhang, K.T. Turner, D. Choi, B. Miller, S.F. Nagle, and S.M. Spearing, “Characterization of silicon wafer bonding for power MEMS applications,” Sensors and Actuators A, 103, 1-8 (2003).

  5. H.Q. Li, D.C. Roberts, J.L. Steyn, K.T. Turner, O. Yaglioglu, N.W. Hagood, S.M. Spearing, and M.A. Schmidt, “Fabrication of a high frequency piezoelectric microvalve,” Sensors and Actuators A, 111, 51-6 (2004).

  6. V.T. Srikar, K.T. Turner, T.Y.A. Ie, and S.M. Spearing, “Structural design considerations for micromachined solid-oxide fuel cells,” Journal of Power Sources, 125, 62-9 (2004).

  7. K.T. Turner, M.D. Thouless, and S.M. Spearing, “Mechanics of wafer bonding: Effect of clamping,” Journal of Applied Physics, 95, 349-55 (2004).

  8. K.T. Turner, S.M. Spearing, W.A. Baylies, M. Robinson, and R. Smythe, “Effect of nanotopography in direct wafer bonding: Modeling and measurements,” IEEE Transactions on Semiconductor Manufacturing, 18, 289-96 (2005).

  9. K.T. Turner and S.M. Spearing, “Mechanics of direct wafer bonding,” Proceedings of the Royal Society of London A, 462, 171-88 (2006).  

  10. M. Puig-De-Morales-Marinkovic, K. T. Turner, J. P. Butler, J. J. Fredberg, and S. Suresh, "Viscoelasticity of the human red blood cell," American Journal of Physiology-Cell Physiology, 293, C597-C605 (2007).

  11. K.T. Turner and S.M. Spearing, “Accurate characterization of wafer bond toughness with the double cantilever specimen,” Journal of Applied Physics, 103, 013514 (2008).

  12. M. Nataraju, J. Sohn, S. Veeraraghavan, A. Mikkelson, K.T. Turner, R. Engelstad, C. Van Peski, and K.J. Orvek, “Electrostatic chucking for extreme ultraviolet lithography: Simulations and experiments,” Journal of Vacuum Science and Technology B, 24, 2834-2839 (2006).

  13. V. Ramaswamy, R. L. Engelstad, K.T. Turner, A. R. Mikkelson, and S. Veeraraghavan, "Distortion of chucked extreme ultraviolet reticles from entrapped particles," Journal of Vacuum Science and Technology B, 24, 2829-2833 (2006).

  14. J. J. Dyreby, G. F. Nellis, and K.T. Turner, "Simulating fluid flow in lithographically directed, evaporation driven self-assembly systems," Microelectronic Engineering, 84, 1519-1522 (2007).

  15. M.R. Sogard, A.R. Mikkelson, M. Nataraju, K.T. Turner, and R.L. Engelstad, “Analysis of Coulomb and Johnson-Rahbek electrostatic chuck performance for EUV Lithography” Journal of Vacuum Science and Technology B, 25, 2155-2161 (2007).

  16. M.R. Tupek and K.T. Turner, “Sub-micron aligned wafer bonding via capillary forces,” Journal of Vacuum Science and Technology B, 25, 1976-1981 (2007).

  17. R. Tadepalli, K.T. Turner, and C.V. Thompson, “Mixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test,” Journal of the Mechanics and Physics of Solids, 56, 707-718 (2008).

  18. R. Tadepalli and K.T. Turner, “A chevron specimen for the measurement of mixed-mode interface toughness of wafer bonds,” Engineering Fracture Mechanics, 75, 1310-1319 (2008).

  19. R. Tadepalli, K.T. Turner, and C.V. Thompson, “Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds,” Acta Materialia, 56, 438-447 (2008). 

  20. Y. Mo, K. T. Turner, and I. Szlufarska,Friction laws at the nanoscale,” Nature, 457 1116-1119 (2009).

  21. H.-J. Kim-Lee, D. E. Savage, C. S. Ritz, M. G. Lagally, and K. T. Turner, “Control of three-dimensional island growth with mechanically responsive single-crystal nanomembrane substrates,” Physical Review Letters, 102, 226103 (2009).

  22. K.T. Turner, S. Veeraraghavan, and J.K. Sinha, “Predicting distortions and overlay errors due to wafer deformation during chucking on lithography scanners,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 8, 043015 (2009). 

  23. B.A. Jasperson, Y. Jeon, K.T. Turner, F.E. Pfefferkorn, and W. Qu, “Comparison of micro-pin-fin and microchannel heat sinks considering thermal-hydraulic performance and manufacturability,” IEEE Transactions on Components and Packaging Technologies, 33, 148-60 (2010).

  24. K.V. Christ and K.T. Turner, “Methods to measure the strength of cell adhesion to substrates,” Journal of Adhesion Science and Technology, 24, 2027-2058 (2010).

  25. K.V. Christ, K.B. Williamson, K.S. Masters, and K.T. Turner, “Measurement of single-cell adhesion strength using a microfluidic assay,” Biomedical Microdevices, 12, 443-55 (2010).

  26. J. Liu, D.S. Grierson, N. Moldovan, J. Notbohm, S. Li, P. Jaroenapibal, S.D. O’Connor, A. V. Sumant, N. Neelakantan, J.A. Carlisle, K.T. Turner, R.W. Carpick, “Preventing nanoscale wear of atomic force microscopy tips through the use of monolithic ultrananocrystalline diamond probes,” Small, 6, 1140-49 (2010). 

  27. J. Liu, J. Notbohm, R.W. Carpick, and K.T. Turner, “Method for characterizing nanoscale wear of atomic force microscope tips,” ACS Nano, 4, 3763-72 (2010).

  28. C.S. Ritz, H.-J. Kim-Lee, D.M. Detert, M.M. Kelly, F.S. Flack, D.E. Savage, Z. Cai, P.G. Evans, K.T. Turner, and M.G. Lagally, “Ordering of nanostressors on freestanding silicon nanomembranes and nanoribbons,” New Journal of Physics 12, 103011 (2010).

  29. J. Vivanco, B. Smith, A. Blake, J.C. Williams, K.T. Turner, and H. Ploeg, “3D elastomeric scaffolds fabricated by casting in micro end milled moulds,” Journal of Biomimetics, Biomaterials, and Tissue Engineering, 9, 17-23 (2010).

  30. W. Chen, X. Tang, J. Considine, and K.T. Turner, “Effect of inorganic fillers in paper on the adhesion of pressure sensitive adhesives,” Journal of Adhesion Science and Technology, 25, 581-96 (2011).

  31. K.V. Christ and K.T. Turner, "Design of Hydrodynamically confined microfluidics," Lab on a Chip, 11, 1491-1501 (2011).

  32. P. Vukkadala, K.T. Turner, J.K. Sinha, “Impact of wafer geometry on CMP for advanced nodes,” Journal of the Electrochemical Society, 158, H1002-9 (2011).

  33. A. Carlson, H.J. Kim-Lee, J. Wu, P. Elvikis, H.Y. Cheng, A. Kovalsky, P.M. Ferreira, Y.G. Huang, K.T. Turner, and J.A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Applied Physics Letters, 98, 264104 (2011).

  34. F. Cavallo, D.S. Grierson, K.T. Turner, and M.G. Lagally, “’Soft Si: Effective stiffness of supported crystalline nanomembranes,” ACS Nano, 5, 5400-7 (2011).

  35. J.M. Considine, D.W. Vahey, J.W. Evans, K.T. Turner, and R.E. Rowlands, “Evaluation of strength-controlling defects in paper by stress concentration analyses,” Journal of Composite Materials, in press, available online (2011).

  36. N. Moldovan, Z. Dai, H. Zeng, J.A. Carlisle, T.D. Jacobs, V. Vahdat, D.S. Grierson, J. Liu, K.T. Turner, and R.W. Carpick, “Advances in Manufacturing of Molded Tips for Scanning Probe Microscopy,” Journal of Microelectromechanical Systems, 21, 431-42 (2012).

  37. K.T. Turner, S. Veeraraghavan, and, J.K. Sinha, “Relationship between localized wafer shape changes induced by residual stress and overlay errors,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 11, 013001 (2012).

  38. H. Cheng, J. Wu, Q. Yu, H.-J. Kim-Lee, A. Carlson, K. T. Turner, K.-C. Hwang, Y. Huang, and J.A. Rogers, “An analytical model for shear-enhanced adhesiveless transfer printing,” Mechanics Research Communications, 43, 46-49 (2012).

  39. D.S. Grierson, J. Liu, R.W. Carpick, and K.T. Turner, “Adhesion of nanoscale asperities with power-law profiles,” Journal of Mechanics and Physics of Solids, 61, 597-610 (2013).

  40. M.J. Wald, J.M. Considine, and K.T. Turner, “Determining the Elastic Modulus of Compliant Thin Films Supported on Substrates from Flat Punch Indentation Measurements,” Experimental Mechanics, 1-11 (2013).

  41. V. Vahdat, D.S. Grierson, K.T. Turner, and R.W. Carpick, “Mechanics of Interaction and Atomic-Scale Wear of Amplitude Modulation Atomic Force Microscopy Probes, ACS Nano, 7, 3221-3235 (2013).

  42. T.D.B. Jacobs, K.E. Ryan, P.L Keating, D.S. Grierson, J.A. Lefever, K.T. Turner, J.A. Harrison,  and R.W. Carpick, “The effect of atomic-scale roughness on the adhesion of nanoscale asperities: a combined simulation and experimental investigation,” Tribology Letters, 50, 81-93 (2013).

  43. K.T. Turner, R. Ramkhalawon, and J.K. Sinha, “The role of wafer geometry in wafer chucking,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 12, 023007(2013).

  44. J. Gong, P. Vukkadala, J. Sinha, and K.T. Turner, “Determining local residual stresses from high resolution wafer geometry measurements,” Journal of Vacuum Science and Technology B, 31, 051205 (2013).

  45. F. Cavallo, K.T. Turner, and M.G. Lagally, “Facile Fabrication of Ordered Crystalline-Semiconductor Microstructures on Compliant Substrates,” Advanced Functional Materials, 24, 1730-1737 (2014).  

  46. K.E. Ryan, P.L. Keating, T.D. B. Jacobs,  D.S. Grierson, K.T. Turner, R.W. Carpick, and J.A. Harrison, “Simulated Adhesion between Realistic Hydrocarbon Materials: Effects of Composition, Roughness, and Contact Point,” Langmuir, in press (2014).

  47. H.J. Kim-Lee, A. Carlson, D.S. Grierson, J.A. Rogers, and K.T. Turner, “Interface mechanics of adhesiveless microtransfer printing processes,” Journal of Applied Physics, in press (2014).