Turner Researh Group Heading
 
 

 

PUBLICATIONS IN REFEREED JOURNALS

  1. W.N. Sharpe Jr., K.T. Turner, and R.L. Edwards, “Tensile testing of polysilicon,” Experimental Mechanics, 39, 162-70 (1999).

  2. D.C. Roberts, H. Li, J. Steyn, K.T. Turner, R. Mlcak, L. Saggere, S.M. Spearing, M.A. Schmidt, and N.W. Hagood, “A high frequency, high stiffness piezoelectric actuator for microhydraulic applications,” Sensors and Actuators A, 97-98, 620-31 (2002).

  3. K.T. Turner and S.M. Spearing, “Modeling of direct wafer bonding: Effect of wafer bow and etch patterns,” Journal of Applied Physics, 92, 7658-66 (2002).

  4. A.A. Ayon, X. Zhang, K.T. Turner, D. Choi, B. Miller, S.F. Nagle, and S.M. Spearing, “Characterization of silicon wafer bonding for power MEMS applications,” Sensors and Actuators A, 103, 1-8 (2003).

  5. H.Q. Li, D.C. Roberts, J.L. Steyn, K.T. Turner, O. Yaglioglu, N.W. Hagood, S.M. Spearing, and M.A. Schmidt, “Fabrication of a high frequency piezoelectric microvalve,” Sensors and Actuators A, 111, 51-6 (2004).

  6. V.T. Srikar, K.T. Turner, T.Y.A. Ie, and S.M. Spearing, “Structural design considerations for micromachined solid-oxide fuel cells,” Journal of Power Sources, 125, 62-9 (2004).

  7. K.T. Turner, M.D. Thouless, and S.M. Spearing, “Mechanics of wafer bonding: Effect of clamping,” Journal of Applied Physics, 95, 349-55 (2004).

  8. K.T. Turner, S.M. Spearing, W.A. Baylies, M. Robinson, and R. Smythe, “Effect of nanotopography in direct wafer bonding: Modeling and measurements,” IEEE Transactions on Semiconductor Manufacturing, 18, 289-96 (2005).

  9. K.T. Turner and S.M. Spearing, “Mechanics of direct wafer bonding,” Proceedings of the Royal Society of London A, 462, 171-88 (2006).  

  10. M. Puig-De-Morales-Marinkovic, K. T. Turner, J. P. Butler, J. J. Fredberg, and S. Suresh, "Viscoelasticity of the human red blood cell," American Journal of Physiology-Cell Physiology, 293, C597-C605 (2007).

  11. K.T. Turner and S.M. Spearing, “Accurate characterization of wafer bond toughness with the double cantilever specimen,” Journal of Applied Physics, 103, 013514 (2008).

  12. M. Nataraju, J. Sohn, S. Veeraraghavan, A. Mikkelson, K.T. Turner, R. Engelstad, C. Van Peski, and K.J. Orvek, “Electrostatic chucking for extreme ultraviolet lithography: Simulations and experiments,” Journal of Vacuum Science and Technology B, 24, 2834-2839 (2006).

  13. V. Ramaswamy, R. L. Engelstad, K.T. Turner, A. R. Mikkelson, and S. Veeraraghavan, "Distortion of chucked extreme ultraviolet reticles from entrapped particles," Journal of Vacuum Science and Technology B, 24, 2829-2833 (2006).

  14. J. J. Dyreby, G. F. Nellis, and K.T. Turner, "Simulating fluid flow in lithographically directed, evaporation driven self-assembly systems," Microelectronic Engineering, 84, 1519-1522 (2007).

  15. M.R. Sogard, A.R. Mikkelson, M. Nataraju, K.T. Turner, and R.L. Engelstad, “Analysis of Coulomb and Johnson-Rahbek electrostatic chuck performance for EUV Lithography” Journal of Vacuum Science and Technology B, 25, 2155-2161 (2007).

  16. M.R. Tupek and K.T. Turner, “Sub-micron aligned wafer bonding via capillary forces,” Journal of Vacuum Science and Technology B, 25, 1976-1981 (2007).

  17. R. Tadepalli, K.T. Turner, and C.V. Thompson, “Mixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test,” Journal of the Mechanics and Physics of Solids, 56, 707-718 (2008).

  18. R. Tadepalli and K.T. Turner, “A chevron specimen for the measurement of mixed-mode interface toughness of wafer bonds,” Engineering Fracture Mechanics, 75, 1310-1319 (2008).

  19. R. Tadepalli, K.T. Turner, and C.V. Thompson, “Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds,” Acta Materialia, 56, 438-447 (2008). 

  20. Y. Mo, K. T. Turner, and I. Szlufarska,Friction laws at the nanoscale,” Nature, 457 1116-1119 (2009).

  21. H.-J. Kim-Lee, D. E. Savage, C. S. Ritz, M. G. Lagally, and K. T. Turner, “Control of three-dimensional island growth with mechanically responsive single-crystal nanomembrane substrates,” Physical Review Letters, 102, 226103 (2009).

  22. K.T. Turner, S. Veeraraghavan, and J.K. Sinha, “Predicting distortions and overlay errors due to wafer deformation during chucking on lithography scanners,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 8, 043015 (2009). 

  23. B.A. Jasperson, Y. Jeon, K.T. Turner, F.E. Pfefferkorn, and W. Qu, “Comparison of micro-pin-fin and microchannel heat sinks considering thermal-hydraulic performance and manufacturability,” IEEE Transactions on Components and Packaging Technologies, 33, 148-60 (2010).

  24. K.V. Christ and K.T. Turner, “Methods to measure the strength of cell adhesion to substrates,” Journal of Adhesion Science and Technology, 24, 2027-2058 (2010).

  25. K.V. Christ, K.B. Williamson, K.S. Masters, and K.T. Turner, “Measurement of single-cell adhesion strength using a microfluidic assay,” Biomedical Microdevices, 12, 443-55 (2010).

  26. J. Liu, D.S. Grierson, N. Moldovan, J. Notbohm, S. Li, P. Jaroenapibal, S.D. O’Connor, A. V. Sumant, N. Neelakantan, J.A. Carlisle, K.T. Turner, R.W. Carpick, “Preventing nanoscale wear of atomic force microscopy tips through the use of monolithic ultrananocrystalline diamond probes,” Small, 6, 1140-49 (2010). 

  27. J. Liu, J. Notbohm, R.W. Carpick, and K.T. Turner, “Method for characterizing nanoscale wear of atomic force microscope tips,” ACS Nano, 4, 3763-72 (2010).

  28. C.S. Ritz, H.-J. Kim-Lee, D.M. Detert, M.M. Kelly, F.S. Flack, D.E. Savage, Z. Cai, P.G. Evans, K.T. Turner, and M.G. Lagally, “Ordering of nanostressors on freestanding silicon nanomembranes and nanoribbons,” New Journal of Physics 12, 103011 (2010).

  29. J. Vivanco, B. Smith, A. Blake, J.C. Williams, K.T. Turner, and H. Ploeg, “3D elastomeric scaffolds fabricated by casting in micro end milled moulds,” Journal of Biomimetics, Biomaterials, and Tissue Engineering, 9, 17-23 (2010).

  30. W. Chen, X. Tang, J. Considine, and K.T. Turner, “Effect of inorganic fillers in paper on the adhesion of pressure sensitive adhesives,” Journal of Adhesion Science and Technology, 25, 581-96 (2011).

  31. K.V. Christ and K.T. Turner, "Design of Hydrodynamically confined microfluidics," Lab on a Chip, 11, 1491-1501 (2011).

  32. P. Vukkadala, K.T. Turner, J.K. Sinha, “Impact of wafer geometry on CMP for advanced nodes,” Journal of the Electrochemical Society, 158, H1002-9 (2011).

  33. A. Carlson, H.J. Kim-Lee, J. Wu, P. Elvikis, H.Y. Cheng, A. Kovalsky, P.M. Ferreira, Y.G. Huang, K.T. Turner, and J.A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Applied Physics Letters, 98, 264104 (2011).

  34. F. Cavallo, D.S. Grierson, K.T. Turner, and M.G. Lagally, “’Soft Si: Effective stiffness of supported crystalline nanomembranes,” ACS Nano, 5, 5400-7 (2011).

  35. J.M. Considine, D.W. Vahey, J.W. Evans, K.T. Turner, and R.E. Rowlands, “Evaluation of strength-controlling defects in paper by stress concentration analyses,” Journal of Composite Materials, in press, available online (2011).

  36. N. Moldovan, Z. Dai, H. Zeng, J.A. Carlisle, T.D. Jacobs, V. Vahdat, D.S. Grierson, J. Liu, K.T. Turner, and R.W. Carpick, “Advances in Manufacturing of Molded Tips for Scanning Probe Microscopy,” Journal of Microelectromechanical Systems, 21, 431-42 (2012).

  37. K.T. Turner, S. Veeraraghavan, and, J.K. Sinha, “Relationship between localized wafer shape changes induced by residual stress and overlay errors,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 11, 013001 (2012).

  38. H. Cheng, J. Wu, Q. Yu, H.-J. Kim-Lee, A. Carlson, K. T. Turner, K.-C. Hwang, Y. Huang, and J.A. Rogers, “An analytical model for shear-enhanced adhesiveless transfer printing,” Mechanics Research Communications, 43, 46-49 (2012).

  39. D.S. Grierson, J. Liu, R.W. Carpick, and K.T. Turner, “Adhesion of nanoscale asperities with power-law profiles,” Journal of Mechanics and Physics of Solids, 61, 597-610 (2013).

  40. M.J. Wald, J.M. Considine, and K.T. Turner, “Determining the Elastic Modulus of Compliant Thin Films Supported on Substrates from Flat Punch Indentation Measurements,” Experimental Mechanics, 1-11 (2013).

  41. V. Vahdat, D.S. Grierson, K.T. Turner, and R.W. Carpick, “Mechanics of Interaction and Atomic-Scale Wear of Amplitude Modulation Atomic Force Microscopy Probes, ACS Nano, 7, 3221-3235 (2013).

  42. T.D.B. Jacobs, K.E. Ryan, P.L Keating, D.S. Grierson, J.A. Lefever, K.T. Turner, J.A. Harrison,  and R.W. Carpick, “The effect of atomic-scale roughness on the adhesion of nanoscale asperities: a combined simulation and experimental investigation,” Tribology Letters, 50, 81-93 (2013).

  43. K.T. Turner, R. Ramkhalawon, and J.K. Sinha, “The role of wafer geometry in wafer chucking,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 12, 023007(2013).

PUBLICATIONS IN CONFERENCE PROCEEDINGS

  1. W.N. Sharpe Jr., K. Turner, and R.L. Edwards, “Polysilicon tensile testing with electrostatic gripping,” in Materials Research Society Symposium Proceedings, 518, 191-6 (1998).

  2. W.N. Sharpe Jr., K. Turner, and R.L. Edwards, “Electrostatic mechanical testing of polysilicon,” in ASME Micro-electro-mechanical Systems, 385-8 (1998).

  3. W.N. Sharpe Jr. and K.T. Turner, “Fatigue testing of materials used in microelectromechanical systems,” in Fatigue ’99: 7th International Fatigue Congress, 1837-44 (1999).

  4. H.Q. Li, D.C. Roberts, J.L. Steyn, K.T. Turner, J.A. Carretero, O. Yaglioglu, Y.-H. Su, R. Mlcak, S.M. Spearing, M.A. Schmidt, R. Mlcak, and K.S. Breuer, “A high frequency high flow rate piezoelectrically driven MEMS micropump,” in Hilton Head ’00:  Solid-State Sensor and Actuator Workshop, 69-72 (2000).

  5. L. Saggere, N.W. Hagood, D.C. Roberts, H.Q. Li, J.L. Steyn, K. Turner, J.A. Carretero, O. Yaglioglu, Y.-H. Su, R. Mlcak, S.M. Spearing, K.S. Breuer, and M.A. Schmidt, “Design, fabrication and testing of a piezoelectrically driven high flow-rate micro-pump,” in IEEE International Symposium on Applications of Ferroelectrics, 297-300 (2000).

  6. K.T. Turner, A.A. Ayon, D. Choi, B. Miller, and S.M. Spearing, “Characterization of silicon fusion bonds using a four-point bend specimen,” in Materials Research Society Symposium Proceedings, 657, EE631-6 (2001).

  7. D.C. Roberts, J.L. Steyn, H. Li, K.T. Turner, R. Mlcak, L. Saggere, S.M. Spearing, M.A. Schmidt, and N.W. Hagood, “A high-frequency, high-stiffness piezoelectric micro-actuator for hydraulic applications,” in Transducers ’01: 11th International Conference Solid State Sensors and Actuators, 686-9 (2001).

  8. K.T. Turner, R. Mlcak, D.C. Roberts and S.M. Spearing, “Bonding of bulk piezoelectric material to silicon using a gold tin eutectic bond,” in Materials Research Society Symposium Proceedings, 687, B3.2.1-6. (2002).

  9. J.L. Steyn, H.Q. Li, D.C. Roberts, K.T. Turner, O. Yaglioglu, Y.-H. Su, M.A. Schmidt, S.M. Spearing, and N.W. Hagood, “Hydraulic amplification devices for microscale actuation,” in Hilton Head ’02:  Solid-State Sensor and Actuator Workshop, 50-3 (2002).

  10. A.A. Ayon, X. Zhang, K.T. Turner, D. Choi, B. Miller, S. Nagle, and S.M. Spearing, “Low temperature silicon wafer bonding for MEMS applications,” in Proceedings of IEEE MEMS 2002, 411-4 (2002).

  11. K.T. Turner and S.M. Spearing, “Measurement of the work of adhesion on wafers for direct bonding,” in Materials Research Society Symposium Proceedings, 782, 463-8 (2003).

  12. K.T. Turner and S.M. Spearing, “Mechanics of direct wafer bonding,” in 2003 ASME International Mechanical Engineering Congress, MEMS, 163-8 (2003).

  13. K.T. Turner and S.M. Spearing, “Role of wafer bow and etch patterns in direct wafer bonding,” in Seventh International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, PV 2003-19, 166-74 (2003).

  14. H.Q. Li, D.C. Roberts, J.L. Steyn, K.T. Turner, O. Yaglioglu, N.W. Hagood, S.M. Spearing, and M.A. Schmidt, “Fabrication of a microvalve with piezoelectric actuation,” in Proceedings of the IEEE MEMS 2003, 92-5 (2003).

  15. K.T. Turner and S.M. Spearing, “Experimental validation of mechanics-based process models for direct wafer bonding,” in Hilton Head ’04:  Solid-State Sensor, Actuator, and Microsystems Workshop, 196-9 (2004).

  16. K.T. Turner, S.M. Spearing, P. Hester, J. Sinha, and W.A. Baylies, “Effect of wafer-scale shape variations and mounting in wafer bonding,” in Eighth International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, PV 2005-02, 270-9 (2005).

  17. *K.T. Turner and S.M. Spearing, “Mechanical aspects of wafer bonding” in Eighth International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, PV 2005-02, 241-52 (2005).

  18.  M. Nataraju, J. Sohn, A.R. Mikkelson, K.T. Turner, R.L. Engelstad, and C.K. Van Peski, “Experimental verification of finite element model prediction of EUVL mask flatness during electrostatic chucking,” in Proceedings of SPIE – Photomask Technology 2006, 6349,634939, (2006).

  19. J. Sohn, S. Veeraraghavan, K.T. Turner, R.L. Engelstad, and E.G. Lovell, and C. K. Van Peski, “Measuring force uniformity during electrostatic chucking of EUVL masks,” in Proceedings of SPIE – Photomask Technology 2006, 6349,63493B, (2006).

  20. V. Ramaswamy, K. T. Turner, R. L. Engelstad, and E. G. Lovell, “Predicting the influence of trapped particles on EUVL reticle distortion during exposure chucking,” in Proceedings of SPIE – Photomask Technology 2006, 6349,634938, (2006).

  21. K.T. Turner, “Mechanics models for the design of wafer bonding tools,” in Proceedings of 2nd Workshop on Wafer Bonding for MEMS Technologies, 31-2(2006).

  22. M. Nataraju, J. Sohn, A. Mikkelson, K.T. Turner, R. Engelstad, C. Van Peski, “EUV mask and chuck analysis: simulation and experimentation,” in Proceedings of SPIE - Emerging Lithographic Technologies X, 6151, 89-99 (2006).

  23. J. Dyreby, G.F. Nellis, K.T. Turner, and R.L. Engelstad, “Modeling lithographically directed, evaporation driven self-assembly systems for magnetic storage arrays,” in Materials Research Society Symposium Proceedings, 961, 224-9 (2006).

  24. H.-J. Kim-Lee, M.R. Tupek, and K.T. Turner, “Capillary assisted alignment for high density wafer-level integration,” in Proceedings of Conference on Wafer Bonding for MEMS Technologies and Wafer-Level Integration, 25-6 (2007).

  25. R. Tadepalli, C.V. Thompson, and K.T. Turner, “Measurement of mixed-mode fracture properties of Cu-Cu bonds using an asymmetric chevron specimen,” in Proceedings of Conference on Wafer Bonding for MEMS Technologies and Wafer-Level Integration, 79-80 (2007).

  26. K.V. Christ, K. B. Williamson, K.S. Masters, and K.T. Turner, “Characterization of the effect of geometry on single cell adhesion strength using a microfluidic device,” in Proceedings of the ASME International Mechanical Engineering Congress and Exposition – IMECE 2007, 10, 809-10 (2007).

  27. S. Veeraraghavan, J. Sohn, K.T. Turner, “Techniques to measure force uniformity of electrostatic chucks for EUV mask clamping,” in Proceedings of SPIE - Photomask Technology 2007, 6730, 67305G (2007).

  28. R.L. Engelstad, K.T. Turner, M. Nataraju, J. Sohn, A.R. Mikkelson, V.S. Battula, P. Vukkadala, J.R. Zeuske, and C.K. Van Peski, “Measuring and characterizing the nonflatness of EUVL reticles and electrostatic chucks,” in Proceedings of SPIE - Photomask Technology 2007, 6730, 673014 (2007).

  29. R.L. Engelstad, J. Sohn, A.R. Mikkelson, M. Nataraju, and K.T. Turner, “Compensating for image placement errors induced during the fabrication and chucking of EUVL masks,” in Proceedings of SPIE - Photomask Technology 2007, 6730, 673004 (2007).

  30. M. Nataraju, J. Sohn, A.R. Mikkelson, R.L. Engelstad, K.T. Turner, C.K. Van Peski, and K.J. Orvek, “Electrostatic Chucking of EUVL Reticles,” in Proceedings of the SPIE- Emerging Lithographic Technologies XI, 6517, 65170Y (2007).

  31. J. Dyreby, G.F. Nellis, K.T. Turner, and R.L. Engelstad, “Simulating droplet dynamics during evaporation-driven self-assembly,” SPIE Symposium on Advanced Lithography in Proceedings of the SPIE- Emerging Lithographic Technologies XI, 6517, 651738 (2007).

  32. K.T. Turner, “Fabricating strained silicon substrates using mechanical deformation during wafer bonding,” in ECS Transactions, 16(8), 321-8 (2008).

  33. H.-J. Kim-Lee, D.E. Savage, C.S. Ritz, M.G. Lagally, and K.T. Turner, “Engineering SiGe growth using mechanically responsive ultrathin substrates,” in ECS Transactions, 16(12), 299-305 (2008).

  34. R.A. Allen, J.C. Marshall, W.A. Baylies, D.T. Read, F. Delrio, K.T. Turner, M. Bernasch, and J. Bagdahn, “A standard Method for measuring wafer bond strength for MEMS applications,” in ECS Transactions, 16(8), 449-55 (2008).

  35. J.C. Nguyen and K.T. Turner, “Surface-interaction mediated adhesion between silicon surfaces Measured with a New Test Method,” in Proceedings of the 31st Annual Meeting of the Adhesion Society , 261-218 (2008).

  36. B.T. Hotle, J.M. Considine, M.J. Wald, R.E. Rowlands, and K.T. Turner, “Effects of thermal aging on mechanical performance of paper,” in Proceedings of Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008, 4, 1790-98 (2008).

  37. R.L. Engelstad, J. Sohn, J.R. Zeuske, V.S. Battula, P. Vukkadala, C.K. Van Peski, K.J. Orvek, K.T. Turner, A.R. Mikkelson, “Status of EUVL reticle chucking,” in Proceedings of the SPIE - EMLC 2008, 24th European Mask and Lithography Conference, 6972, 67920X, (2008).

  38. C.A. Konishi, W. Qu, B.A. Jasperson, F.E. Pfefferkorn, and K.T. Turner, “Experimental study of adiabatic water liquid-vapor two-phase pressure drop across an array of staggered micro-pin-fins,” in Proceedings of the ASME International Mechanical Engineering Congress and Exposition – IMECE 2008, 10, 1597-1605 (2008).

  39. J. Liu, J.K. Notbohm, R.W. Carpick, and K.T. Turner, “Nanoscale wear of atomic force microscope probes,” in Proceedings of the 32nd Annual Meeting of the Adhesion Society, 323(2009).

  40. K.V. Christ, K.B. Williamson, K.S. Masters, and K.T. Turner, “Microfluidic-based adhesion strength measurements of single biological cells,” in Proceedings of the 32nd Annual Meeting of the Adhesion Society, 8(2009).

  41. H.J. Kim-Lee and K.T. Turner, “Adhesion control using structured interfaces: Effects of geometry and loading direction,” in Proceedings of the 32nd Annual Meeting of the Adhesion Society, 253-255 (2009). 

  42. W. Kerr, N. Poduje, and K.T. Turner, “Inspection of bonded interfaces using scanning infrared interferometry,” in Proceedings of WaferBond ’09: Workshop on Wafer Bonding for MEMS Technologies, 41-42 (2009).

  43. R.A. Allen, W. Baylies, P. Langer, R. Danzi, F. Delrio, G. Horn, R. Knechtel, M. Mattes, D. Read, S. Sood, and K.T. Turner, “A round robin experiment to provide precision and bias for SEMI MS5: Test method for wafer bond strength measurements using micro-chevron test structures,” in Proceedings of WaferBond ’09: Workshop on Wafer Bonding for MEMS Technologies, 31-32(2009).

  44. D.S. Grierson, J. Liu, R.W. Carpick, and K.T. Turner, “Mechanics of tip-sample contacts for interpreting AFM pull-off force measurements,” in Proceedings of the 33nd Annual Meeting of the Adhesion Society, 256 (2010).

  45. K.V. Christ and K.T. Turner, “Hydrodynamically-confined microflows for cell adhesion strength measurement,” in the Proceedings of ASME 2010 First Global Congress on NanoEngineering for Medicine and Biology, 13007 (2010).

  46. K.V. Christ, B.B. Smith, F.E. Pfefferkorn, and K.T. Turner, “Micro end milling polystyrene for microfluidic applications,” in Proceedings of the 5th International Conference on Micromanufacturing, 423-30 (2010). 

  47. B. Smith, D.M. Wolf, K.T. Turner, N.A. Duffie, X. Li, and F.E. Pfefferkorn, “Laser polishing of micro-machined microfluidic molds,” in Proceedings of the 5th International Conference on Micromanufacturing, 445-51(2010). 

  48. B.A. Jasperson, F.E. Pfefferkorn, W. Qu, and K.T. Turner, “A thin-film heat flux sensor fabricated on copper for heat transfer measurements in parallel channel heat sinks,” in Proceedings of the 5th International Conference on Micromanufacturing,437-44 (2010). 

  49. J. Vianco, B. Smith, A. Blake, J. Williams, K.T. Turner, and H. Ploeg, “3D elastomeric scaffolds fabricated by casting in micro end milled molds,” in Proceedings of the 5th International Conference on Micromanufacturing, 387-92 (2010). 

  50. M.J. Wald, J.M. Considine, and K.T. Turner, “Measuring the elastic modulus of soft thin films on substrates,” in the Proceedings of the 2010 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 329 (2010).

  51. J.M. Considine, D.W. Vahey, D. Matthys, R.E. Rowlands, and K.T. Turner, “An inverse method for analyzing defects in heterogeneous materials,” in the Proceedings of the 2010 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 257 (2010).

  52. J.T. Decker, A.A. Khaja, M.T. Hoang, J.M. Considine, D.W. Vahey, K.T. Turner and R.E. Rowlands “Variation of paper curl due to fiber orientation,” in the Proceedings of the 2010 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 281 (2010).

  53. J.M. Considine, D.W. Vahey, R.E. Rowlands, and K.T. Turner, “Inherent defect size: Use for composite materials,” in the Proceedings of 16th US National Congress of Theoretical and Applied Mechanics, 990(2010). 

  54. H.-J. Kim-Lee and K.T. Turner, “Mechanics of double cantilever beam specimens with structured interfaces,” in the Proceedings of 16th US National Congress of Theoretical and Applied Mechanics, 730 (2010). 

  55. K.V. Christ and K.T. Turner, “Investigation of the mechanics of single-cell adhesion strength using a microfluidic probe,” in the Proceedings of 16th US National Congress of Theoretical and Applied Mechanics, 1220(2010).

  56. J. Liu, D.S. Grierson, K. Sridharan, R.W. Carpick, and K.T. Turner, “Assessment of the mechanical integrity of silicon and diamond-like carbon coated silicon atomic force microscope probes,” in the Proceedings of SPIE - Instrumentation, Metrology, and Standards for Nanomanufacturing IV, 7767 (2010).

  57. H.J. Kim-Lee and K.T. Turner, “Effect of pattern geometry on the fracture behavior of direct bonded silicon wafers,” in ECS Transactions, 33(4) (2010).

  58. D.S. Grierson and K.T. Turner, “Characterization of hysteresis of surface energy in room-tempearture direct bonding processes,” in ECS Transactions, 33(4) (2010).

  59. N. Podjue, W. Kerr, and K.T. Turner, “Inspection of bonded interfaces using scanning infrared interferometry,” in ECS Transactions, 33(4) (2010).

  60. D. Melanz, M. Tupy, B. Smith, K.T. Turner, and D. Negrut, “On the validation of a differential variational inequality approach for the dynamics of granular material,” in Proceedings ASME 2010 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference (IDETC/CIE2010), 777-89 (2010).

  61. K.T. Turner, “Exploiting mechanics to improve wafer bonding and layer transfer processes,” in Proceeding of WaferBond ’11 (2011).

  62. S. Veeraghaven, K.T. Turner, J. Sinha, “Simulation of non-uniform wafer geometry and thin film residual stress on overlay errors,” in Proceedings of SPIE, 7971, 79711U (2011).

  63. H.-J. Kim-Lee, D.S. Grierson, and K.T. Turner, “Mechanics of microtransfer printing processes,” in Proceedings of the 34nd Annual Meeting of the Adhesion Society, 8(2011).

  64. V. Vahdat, D.S. Grierson, K.T. Turner, and R.W. Carpick, "Nano-scale forces, stresses, and tip geometry evolution of amplitude modulation atomic force microscopy probes" in Proceedings of the ASME 2011 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE 2011), (2011).