Publications

for the most up-to-date list of papers, please see Google Scholar

Refereed Journal Articles

117.A. Luo, R.R. Zhao, J.L. Bassani, A.J. Hart, and K.T. Turner, “The critical role of fracture in determining the adhesion strength of electroadhesives,” Extreme Mechanics Letters, 63, 102062 (2023). https://doi.org/10.1016/j.eml.2023.102062
116.A.M. Zaccarin, G.M. Iyer, R.H. Olsson, K.T. Turner, “Fabrication and characterization of soil moisture sensors on a biodegradable, cellulose-based substrate,” IEEE Sensors Journal, available online (2023). https://doi.org/10.1109/JSEN.2023.3299430 
115.W. Wu, M. Daneker, M.A. Jolley, K.T. Turner, and L. Lu, “Effective data sampling strategies and boundary condition constraints of physics-informed neural networks for identifying material properties in solid mechanics,” Applied Mathematics and Mechanics, 44,1039 (2023). https://doi.org/10.1007/s10483-023-2995-8
114.A. Ramachandran, C.E. Livingston, A. Vite, E.A. Corbin, A.I. Bennett, K.T. Turner, B.W. Lee, C.K. Lam, J.C Wu, and K.B. Margulies, “Biomechanical impact of pathogenic MYBPC3 truncation variant revealed by dynamically tuning in vitro afterload,” Journal of Cardiovascular Translational Research (2023). https://doi.org/10.1007/s12265-022-10348-4
113.S.S. Pande and K.T. Turner, “Geometric optimization of pillars for enhanced adhesion,” Extreme Mechanics Letters, 59, 101969 (2023). https://doi.org/10.1016/j.eml.2023.101969
112.Y. Qiang, K.T. Turner, D. Lee, “The role of polymer-nanoparticle interactions on the fracture toughness of polymer-infiltrated nanoparticle films,” Macromolecules, 56, 122-135 (2022). https://doi.org/10.1021/acs.macromol.2c01567
111.D.J. Levine, G.M. Iyer, K.T. Turner, and J. Pikul, “A mechanics-based approach to realize high-force capacity electroadhesives for robots,” Science Robotics, 7, eabo2179 (2022). https://doi.org/10.1126/scirobotics.abo2179
110.G. Wan, Y. Tang, K.T. Turner, T. Zhang, and W. Shan, “Tunable dry adhesion of soft hollow pillars through sidewall buckling under low pressure,” Advanced Functional Materials, 2209905 (2022). https://doi.org/10.1002/adfm.202209905
109.S. Fulco, M. Budzik, and K.T. Turner, “Decoupling toughness and strength through architected plasticity,” Extreme Mechanics Letters, 101912 (2022). https://doi.org/10.1016/j.eml.2022.101912
108.A. Luo, S.S. Pande, and K.T. Turner, “Versatile adhesion-based gripping via an unstructured variable stiffness membrane,” Soft Robotics (2022). https://doi.org/10.1089/soro.2021.0065
107.A. Luo, H. Wang, and K.T. Turner, “Machine learning-based optimization of the design of composite pillars for dry adhesives,” Extreme Mechanics Letters (2022). https://doi.org/10.1016/j.eml.2022.101695
106.S.A. Wolf, S. Fulco, A. Zhang, H. Zhao, P. Walsh, K.T. Turner, and Z. Fakhraai, “Role of Molecular Layering in the Enhanced Mechanical Properties of Stable Glasses,” The Journal of Physical Chemistry Letters (2022). https://doi.org/10.1021/acs.jpclett.2c00232
105.Y. Qiang, S. Pande, D. Lee, and K.T. Turner, “The interplay of polymer bridging and entanglement in toughening polymer-infiltrated nanoparticle films,” ACS Nano, 16, 6372-81 (2022). https://doi.org/10.1021/acsnano.2c00471
104.R. Spiewak, G.S. Vankayalapati, J.M. Considine, K.T. Turner, and P.K. Purohit, “Humidity dependence of fracture toughness of cellulose fibrous networks,” Engineering Fracture Mechanics, 264, 108330 (2022). https://doi.org/10.1016/j.engfracmech.2022.108330
103.C.R. Kagan, D.P. Arnold, D.J. Cappelleri, C.M. Keske, K.T. Turner, “Special Report: The National Science Foundation engineering research center for the internet of things for precision agriculture (IoT4Ag),” Computers and Electronics in Agriculture, 106742 (2022). https://doi.org/10.1016/j.compag.2022.106742
102.C.J. Stabile, D.J. Levine, G.M. Iyer, C. Majidi, and K.T. Turner, “The role of stiffness in versatile robotic grasping,” IEEE Robotics and Automation Letters, 7, 4733 (2022). https://doi.org/10.1109/LRA.2022.3149036
101.R.R. Zhao, K.T. Turner, and J.L. Bassani, “Exploiting interface patterning for adhesion control,” Journal of the Mechanics and Physics of Solids, 160 (2022). https://doi.org/10.1016/j.jmps.2021.104740
100.A. Luo and K.T. Turner, “Adhesion of beams with subsurface elastic heterogeneity,” Journal of the Mechanics and Physics of Solids, 159, 104713 (2022). https://doi.org/10.1016/j.jmps.2021.104713
99.A.M. Nasab, P. Stampfli, S. Sharifi, A. Luo, K.T. Turner, and W. Shan, “Dynamically tunable dry adhesion through a subsurface thin layer with tunable stiffness,” Advanced Materials Interfaces, 2102080 (2022). https://doi.org/10.1002/admi.202102080
98.G.S. Vankayalapati, E. Kaplan, L.M. Lallo, N. Victor, C.M. Clemons, J.M. Considine, and K.T. Turner, “Toughening poly(methyl methacrylate) via reinforcement with cellulose nanofibrils,” ACS Applied Polymer Materials, 3, 6102-10 (2021). https://doi.org/10.1021/acsapm.1c00933 
97.A.T. Clark, A. Bennett, E. Kraus, K. Pogoda, A. Cēbers, P. Janmey, K.T. Turner, E.A. Corbin, and X. Cheng, “Magnetic field tuning of mechanical properties of ultrasoft PDMS-based magnetorheological elastomers for biological applications,” Multifunctional Materials, 4, 035001 (2021). https://doi.org/10.1088/2399-7532/ac1b7e
96.R.B. Venkatesh, N. Manohar, Y. Qiang, H. Wang, H.H. Tran, B.Q. Kim, A. Neuman, T. Ren, Z. Fakhraai, R.A. Riggleman, K.J. Stebe, K.T. Turner, and D. Lee, “Polymer-infiltrated nanoparticle films using capillarity-based techniques: Toward multifunctional coatings and membranes,” Annual Review of Chemical and Biomolecular Engineering, 12, 411-437 (2021). https://doi.org/10.1146/annurev-chembioeng-101220-093836
95.R. Coulson, C.J. Stabile, K.T. Turner, and C.J. Majidi, “Versatile soft robot gripper enabled by stiffness and adhesion tuning via thermoplastic composite,” Soft Robotics, (2021). https://doi.org/10.1089/soro.2020.0088 
94.A. Luo and K.T. Turner, “Achieving enhanced adhesion through optimal design of stress distributions,” Journal of the Mechanics and Physics of Solids, 156, 104610 (2021) https://doi.org/10.1016/j.jmps.2021.104610
93.D.A. Levine, K.T. Turner, and J.H. Pikul, “Materials with electroprogrammable stiffness,” Advanced Materials, 33, 2007952 (2021). https://doi.org/10.1002/adma.202007952
92.Y. Qiang, K.T. Turner, and D. Lee, “Polymer-infiltrated nanoplatelet films with nacre-like structure via flow coating and capillary rise infiltration (CaRI),” Nanoscale, 13, 5545-56 (2021). https://doi.org/10.1039/d0nr08691f 
91.S. Fulco, S.A. Wolf, J. Jakes, Z. Fakhraai, and K.T. Turner, “Effect of surface detection error due to elastic-plastic deformation on nanoindentation measurements of elastic modulus and hardness,” Journal of Materials Research, 36, 2176-88 (2021). https://doi.org/10.1557/s43578-021-00223-4
90.B.Q. Kim, Y. Qiang, K.T. Turner, S.Q. Choi, and D. Lee, “Heterostructured polymer-infiltrated nanoparticle films with cavities via capillary rise infiltration,” Advanced Materials Interfaces, 8, 2001421 (2021). https://doi.org/10.1002/admi.202001421  
89.M.D. Swift, C.B. Havercamp, C.J. Stabile, D. Hwang, R.H. Plaut, K.T. Turner, D.A. Dillard, and M.D. Bartlett, “Active membranes on rigidity tunable foundations for programmable, rapidly switchable adhesion,” Advanced Materials Technologies, 5, 2000676 (2020). https://doi.org/10.1002/admt.202000676 
88.A. Luo, A. Nasab, M. Tatari, S. Chen, W. Shan, and K.T. Turner, “Adhesion of flat-ended pillars with non-circular contacts,” Soft Matter, 41, 9534-42 (2020). https://doi.org/10.1039/D0SM01105C 
87.A. Luo and K.T. Turner, “Mechanics of crack path selection in microtransfer printing: Challenges and opportunities for process control,”  Journal of the Mechanics and Physics of Solids, 143, 104066 (2020). https://doi.org/10.1016/j.jmps.2020.104066
86.A.M. Nasab, A. Luo, S. Sharifi, K.T. Turner, and W. Shan, “Switchable adhesion via subsurface pressure modulation,” ACS Applied Materials and Interfaces, 12, 27717–25 (2020). https://doi.org/10.1021/acsami.0c05367 
85.S.J. Park, J. Shin, D.J. Magagnosc, S. Kim, C. Cao, K.T. Turner, P.K. Purohit, D.S. Gianola, and A.J. Hart, “Strong, ultralight nanofoams with extreme recovery and dissipation by manipulation of internal adhesive contacts,” ACS Nano, 14, 8383–91 (2020). https://doi.org/10.1021/acsnano.0c02422
84.D. Tan, A. Luo, X. Wang, Z. Shi, Y. Lei, M. Steinhart, A. Kovalev, S.N. Gorb, K.T. Turner, and L. Xue, “Humidity-modulated core–shell nanopillars for enhancement of gecko-inspired adhesion,” ACS Applied Nano Materials, 3, 3596-603 (2020). https://doi.org/10.1021/acsanm.0c00314 
83.S. Heide-Jørgensen, M. K. Budzik and K.T. Turner, “Mechanics and fracture of structured pillar interfaces,” Journal of the Mechanics and Physics of Solids, 137, 103825 (2020). https://doi.org/10.1016/j.jmps.2019.103825
82.L. Mariani, W.R. Johnson III, J.M. Considine, and K.T. Turner, “Printing and mechanical characterization of cellulose nanofibril materials,” Cellulose, 26, 2639-51 (2019). https://doi.org/10.1007/s10570-019-02247-w  
81.S. Kim, Y. Jiang, K. Towell-Thompson, M.S.H. Boutilier, N. Nayakanti, C. Cao, C. Chen, C. Jacob, H. Zhao, K.T. Turner, and A.J. Hart, “Soft nanocomposite electroadhesives for digital micro-and nanotransfer printing,” Science Advances, 5, eaax4790 (2019). https://doi.org/10.1126/sciadv.aax4790 
80.H. Wang, Y. Qiang, A.A. Shamsabadi, P. Mazumder, K.T. Turner, D. Lee, and Z. Fakhraai, “Thermal degradation of polystyrene under extreme nanoconfinement,” ACS Macro Letters, 8, 1413-18 (2019). https://doi.org/10.1021/acsmacrolett.9b00649 
79.E.A. Corbin, A. Vite, E. Peyster, M. Bhoopalam, X. Wang, A. Bennett, K.T. Turner, K. Musunuru, and K.B. Marguiles, “Tunable and reversible substrate stiffness reveals a dynamic mechanosensitivity of cardiomyocytes,” ACS Applied Materials and Interfaces, 11, 20603-14 (2019). https://doi.org/10.1021/acsami.9b02446 
78.K.V. Christ, C. Park, and K.T. Turner, “Design and characterization of a hydrodynamically-confined microflow device for applying controlled loads to investigate single-cell mechanics,” Microfluidics and Nanofluidics, 23, 49 (2019). https://doi.org/10.1007/s10404-019-2210-5 
77.Y. Jiang, J.L. Hor, D. Lee, and K.T. Turner, “Toughening of hard nanoparticle films through polymer infiltration and confinement,” ACS Applied Materials and Interfaces, 10, 44011-17 (2018). https://doi.org/10.1021/acsami.8b15027 
76.W. Chen, W. Liu, Y. Jiang, M. Zhang, N. Song, N.J. Greybush, J. Guo, A.K. Estep, K.T. Turner, R. Agarwal, C.R. Kagan, “Ultrasensitive, mechanically-responsive optical metasurfaces via strain amplification,” ACS Nano, 12, 10683-92 (2018). https://doi.org/10.1021/acsnano.8b04889 
75.M. Tatari, A.M. Nasab, K.T. Turner, and W. Shan, “Dynamically tunable dry adhesion via subsurface stiffness modulation,” Advanced Materials Interfaces, 5, 1800321 (2018). https://doi.org/10.1002/admi.201800321
74.Y. Cho, H.K. Minsky, Y. Jiang, K.Y. Yin, K.T. Turner, and S. Yang, “Shear adhesion of tapered nanopillar arrays,” ACS Applied Materials and Interfaces, 10, 11391-97 (2018). https://doi.org/10.1021/acsami.8b02303 
73.Q. Zhang, Y. Tang, M. Hajfathalian, C. Chen, K.T. Turner, D.A. Dikin, G.J. Lin, and J. Yin, “Spontaneous periodic delamination of thin films to form crack-free metal and silicon ribbons with high stretchability,” ACS Applied Materials and Interfaces, 9, 44938-47 (2017). https://doi.org/10.1021/acsami.7b15693
72.E.D. Cubuk, R.J.S. Ivancic, S.S. Schoenholz, D.J. Strickland, A. Basu, Z.S. Davidson, J. Fontaine, J.L. Hor, Y.-R. Huang, Y. Jiang, N.C. Keim, K.D. Koshigan, J.A. Lefever, T. Liu, X.-G. Ma, D.J. Magagnosc, E. Morrow, C.P. Ortiz, J.M. Rieser, A. Shavit, T. Still, Y. Xu, Y. Zhang, K.N. Nordstrom, P.E. Arratia, R.W. Carpick, D.J. Durian, Z. Fakhraai, D.J. Jerolmack, D. Lee, J. Li, R. Riggleman, K.T. Turner, A.G. Yodh, D.S. Gianola and A.J. Liu, “Structure-property relationships from universal signatures of plasticity in disordered solids,” Science, 358, 1033-7 (2017). https://doi.org/10.1126/science.aai8830
71.J. Liu, Y. Jiang, D.S. Grierson, K. Sridharan, Y.C. Shao, T.D.B. Jacobs, M.L. Falk, R.W. Carpick and K.T. Turner, “Tribochemical wear of diamond-like carbon-coated atomic force microscope tips,” ACS Applied Materials and Interfaces, 9, 35341-8 (2017). https://doi.org/10.1021/acsami.7b08026 
70.Y.C. Shao, T.D.B. Jacobs, Y. Jiang, K.T. Turner, R.W. Carpick and M.L. Falk, “Multibond model of single-asperity tribochemical wear at the nanoscale,” ACS Applied Materials and Interfaces, 9, 35333-40 (2017). https://doi.org/10.1021/acsami.7b08023
69.L.J. Xue, B. Sanz, A. Luo, K.T. Turner, X. Wang, D. Tan, R. Zhang, H. Du, M. Steinhart, C. Mijangos, M. Guttmann, M. Kappl and A. del Campo, “Hybrid surface patterns mimicking the design of the adhesive toe pad of tree frog,” ACS Nano, 11, 9711-9 (2017). https://doi.org/10.1021/acsnano.7b04994
68.L.C. Bradley, N.D. Bade, L.M. Mariani, K.T. Turner, D. Lee, and K.J. Stebe, “Rough adhesive hydrogels (RAd Gels) for underwater adhesion,” ACS Applied Materials and Interfaces, 9, 27409-13 (2017). https://doi.org/10.1021/acsami.7b08916  
67.X. Liang, J. Shin, D. Magagnosc, Y. Jiang, S.J. Park, A.J. Hart, K.T. Turner, D.S. Gianola, and P.K.  Purohit, “Compression and recovery of carbon nanotube forests described as a phase transition,” International Journal of Solids and Structures, 122, 196-209 (2017). https://doi.org/10.1016/j.ijsolstr.2017.06.025
66.J.M. Considine, F. Pierron, K.T. Turner, P. Lava, and X. Tang, “Smoothly varying in-plane stiffness heterogeneity evaluated under uniaxial tensile stress,” Strain: An International Journal for Experimental Mechanics, 53, e12237 (2017). https://doi.org/10.1111/str.12237 
65.C. Lin, K. Davami, Y. Jiang, J. Cortes, M. Munther, M. Shaygan, H. Ghassemi, J. Robinson, K.T. Turner, and I. Bargatin. “Enhancing the stiffness of vertical graphene sheets through ion beam irradiation and fluorination,” Nanotechnology, 28, 295701 (2017). https://doi.org/10.1088/1361-6528/aa75ac 
64.H.K. Minsky and K.T. Turner, “Composite microposts with high dry adhesion strength,” ACS Applied Materials and Interfaces, 9, 18322-27 (2017).  https://doi.org/10.1021/acsami.7b01491
63.Y. Jiang, J.A. Harrison, J.D. Schall, K.E. Ryan, R.W. Carpick, and K.T. Turner, “Correcting for tip geometry effects in molecular simulations of single-asperity contact,” Tribology Letters, 65, 78 (2017). https://doi.org/10.1007/s11249-017-0857-1 
62.J.L. Hor, Y. Jiang, D.J. Ring, R.A. Riggleman, K.T. Turner, and D. Lee, “Nanoporous polymer-infiltrated nanoparticle films with uniform or graded porosity via undersaturated capillary rise infiltration,” ACS Nano, 11, 3229-36 (2017).  https://doi.org/10.1021/acsnano.7b00298
61.D.S. Grierson, F.S. Flack, M.G. Lagally, and K.T. Turner, “Rolling-based direct-transfer printing: A process for large-area transfer of micro-and nanostructures onto flexible substrates,” Journal of Applied Physics, 120, 093103 (2016). https://doi.org/10.1063/1.4961407  
60.Y. Jiang and K.T. Turner, “Measurement of the strength and range of adhesion using atomic force microscopy,” Extreme Mechanics Letters, 9, 119-26 (2016). https://doi.org/10.1016/j.eml.2016.05.013  
59.C.-H. Pi and K.T. Turner, “Design, analysis, and characterization of stress-engineered 3D microstructures comprised of PECVD silicon oxide and nitride,” Journal of Micromechanics and Microengineering, 26, 65010 (2016). https://doi.org/10.1088/0960-1317/26/6/065010
58.K. Davami, Y. Jiang, J. Cortes, C. Lin, M. Shaygan, K.T. Turner, and I. Bargatin, “Tuning the mechanical properties of vertical graphene sheets through atomic layer deposition,” Nanotechnology, 27, 155701 (2016). https://doi.org/10.1088/0957-4484/27/15/155701
57.K.T. Turner, P. Vukkadala, and J.K. Sinha, “Models to relate wafer geometry measurements to in-plane distortion of wafers,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 15, 021404 (2016). https://doi.org/10.1117/1.jmm.15.2.021404
56.K. Davami, Y. Jiang, C. Lin, J. Cortes, J.T. Robinson, K.T. Turner, and I. Bargatin, “Modification of mechanical properties of vertical graphene sheets via fluorination,” RSC Advances, 6, 11161-11166 (2016). https://doi.org/10.1039/c5ra25068d
55.Y. Cho, G. Kim, Y. Cho, S. Yeon Lee, H. Minsky, K.T. Turner, D.S. Gianola, and S. Yang, “Orthogonal control of stability and tunable dry adhesion by tailoring shapes of tapered nanopillar arrays,” Advanced Materials, 27, 7788-93 (2015). https://doi.org/10.1002/adma.201503347
54.H.K. Minsky and K.T. Turner, “Achieving enhanced and tunable adhesion via composite posts,” Applied Physics Letters, 106, 201604 (2015). https://doi.org/10.1063/1.4921423 
53.G.M. Erickson, D.I. Kay1, M.A. Sidebottom, K.T. Turner, N. Ip, M.A. Norell, W.G. Sawyer and B.A. Krick, “Wear biomechanics in the slicing dentition of the giant horned dinosaur, triceratops,” Science Advances, 1, e1500055 (2015). https://doi.org/10.1126/sciadv.1500055
52.Y.-R. Huang, Y. Jiang, J.L. Hor, R. Gupta, L. Zhang, K.J. Stebe, G. Feng, K.T. Turner, and D. Lee, “Polymer nanocomposite films with extremely high nanoparticle loadings via capillary rise infiltration (CaRI),” Nanoscale, 7, 798-805 (2015). https://doi.org/10.1039/c4nr05464d
51.B.A. Jasperson, J. Schmale, W. Qu, F.E. Pfefferkorn, and K.T. Turner, “Thin film heat flux sensors fabricated on copper substrates for thermal measurements in microfluidic environments,” Journal of Micromechanics and Microengineering, 24, 125018 (2014). https://doi.org/10.1088/0960-1317/24/12/125018
50.Y. Jiang, D.S. Grierson, and K.T. Turner, “Flat punch adhesion: Transition from fracture-based to strength-limited pull-off,” Journal of Physics D: Applied Physics, 47, 325301 (2014). https://doi.org/10.1088/0022-3727/47/32/325301
49.V. Vahdat, K.E. Ryan, P.L. Keating, Y. Jiang, S.P. Adiga, J.D. Schall, K.T. Turner, J.A. Harrison, and R.W. Carpick, “Atomic-scale wear of amorphous hydrogenated carbon during intermittent contact: a combined study using experiment, simulation, and theory,” ACS Nano, 8, 7027-40 (2014). https://doi.org/10.1021/nn501896e
48.J. Considine, F. Pierron, K.T. Turner, and D.W. Vahey, “General anisotropy identification of paperboard with virtual fields method,” Experimental Mechanics, 54, 1395-410 (2014). https://doi.org/10.1007/s11340-014-9903-1
47.H.J. Kim-Lee, A. Carlson, D.S. Grierson, J.A. Rogers, and K.T. Turner, “Interface mechanics of adhesiveless microtransfer printing processes,” Journal of Applied Physics, 115, 143513 (2014). https://doi.org/10.1063/1.4870873
46.K.E. Ryan, P.L. Keating, T.D. B. Jacobs, D.S. Grierson, K.T. Turner, R.W. Carpick, and J.A. Harrison, “Simulated adhesion between realistic hydrocarbon materials: Effects of composition, roughness, and contact point,” Langmuir, 30, 2028–37 (2014). https://doi.org/10.1021/la404342d
45.F. Cavallo, K.T. Turner, and M.G. Lagally, “Facile fabrication of ordered crystalline-semiconductor microstructures on compliant substrates,” Advanced Functional Materials, 24, 1730-37 (2014).  https://doi.org/10.1002/adfm.201303165
44.J. Gong, P. Vukkadala, J. Sinha, and K.T. Turner, “Determining local residual stresses from high resolution wafer geometry measurements,” Journal of Vacuum Science and Technology B, 31, 051205 (2013). https://doi.org/10.1116/1.4818884
43.K.T. Turner, R. Ramkhalawon, and J.K. Sinha, “The role of wafer geometry in wafer chucking,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 12, 023007 (2013). https://doi.org/10.1117/1.jmm.12.2.023007
42.T.D.B. Jacobs, K.E. Ryan, P.L Keating, D.S. Grierson, J.A. Lefever, K.T. Turner, J.A. Harrison,  and R.W. Carpick, “The effect of atomic-scale roughness on the adhesion of nanoscale asperities: a combined simulation and experimental investigation,” Tribology Letters, 50, 81-93 (2013). https://doi.org/10.1007/s11249-012-0097-3
41.V. Vahdat, D.S. Grierson, K.T. Turner, and R.W. Carpick, “Mechanics of interaction and atomic-scale wear of amplitude modulation atomic force microscopy probes,” ACS Nano, 7, 3221-35 (2013). https://doi.org/10.1021/nn305901n
40.M.J. Wald, J.M. Considine, and K.T. Turner, “Determining the elastic modulus of compliant thin films supported on substrates from flat punch indentation measurements,” Experimental Mechanics, 53, 931-41 (2013). https://doi.org/10.1007/s11340-012-9705-2
39.D.S. Grierson, J. Liu, R.W. Carpick, and K.T. Turner, “Adhesion of nanoscale asperities with power-law profiles,” Journal of Mechanics and Physics of Solids, 61, 597-610 (2013). https://doi.org/10.1016/j.jmps.2012.09.003
38.H. Cheng, J. Wu, Q. Yu, H.-J. Kim-Lee, A. Carlson, K. T. Turner, K.-C. Hwang, Y. Huang, and J.A. Rogers, “An analytical model for shear-enhanced adhesiveless transfer printing,” Mechanics Research Communications, 43, 46-9 (2012). https://doi.org/10.1016/j.mechrescom.2012.02.011
37.K.T. Turner, S. Veeraraghavan, and, J.K. Sinha, “Relationship between localized wafer shape changes induced by residual stress and overlay errors,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 11, 013001 (2012). https://doi.org/10.1117/1.jmm.11.1.013001
36.N. Moldovan, Z. Dai, H. Zeng, J.A. Carlisle, T.D. Jacobs, V. Vahdat, D.S. Grierson, J. Liu, K.T. Turner, and R.W. Carpick, “Advances in manufacturing of molded tips for scanning probe microscopy,” Journal of Microelectromechanical Systems, 21, 431-42 (2012). https://doi.org/10.1109/jmems.2011.2174430
35.J.M. Considine, D.W. Vahey, J.W. Evans, K.T. Turner, and R.E. Rowlands, “Evaluation of strength-controlling defects in paper by stress concentration analyses,” Journal of Composite Materials, 46, 1323-34 (2012). https://doi.org/10.1177/0021998311418262
34.F. Cavallo, D.S. Grierson, K.T. Turner, and M.G. Lagally, “’Soft Si: Effective stiffness of supported crystalline nanomembranes,” ACS Nano, 5, 5400-7 (2011). https://doi.org/10.1021/nn200461g
33.A. Carlson, H.J. Kim-Lee, J. Wu, P. Elvikis, H.Y. Cheng, A. Kovalsky, P.M. Ferreira, Y.G. Huang, K.T. Turner, and J.A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Applied Physics Letters, 98, 264104 (2011). https://doi.org/10.1063/1.3605558
32.P. Vukkadala, K.T. Turner, and J.K. Sinha, “Impact of wafer geometry on CMP for advanced nodes,” Journal of the Electrochemical Society, 158, H1002-9 (2011). https://doi.org/10.1149/1.3615988
31.K.V. Christ and K.T. Turner, “Design of hydrodynamically confined microfluidics,” Lab on a Chip, 11, 1491-501 (2011).  https://doi.org/10.1039/c0lc00416b
30.W. Chen, X. Tang, J. Considine, and K.T. Turner, “Effect of inorganic fillers in paper on the adhesion of pressure sensitive adhesives,” Journal of Adhesion Science and Technology, 25, 581-96 (2011). https://doi.org/10.1163/016942410X525830
29.J. Vivanco, B. Smith, A. Blake, J.C. Williams, K.T. Turner, and H. Ploeg, “3D elastomeric scaffolds fabricated by casting in micro end milled moulds,” Journal of Biomimetics, Biomaterials, and Tissue Engineering, 9, 17-23 (2011). https://doi.org/10.4028/www.scientific.net/jbbte.9.17
28.C.S. Ritz, H.-J. Kim-Lee, D.M. Detert, M.M. Kelly, F.S. Flack, D.E. Savage, Z. Cai, P.G. Evans, K.T. Turner, and M.G. Lagally, “Ordering of nanostressors on freestanding silicon nanomembranes and nanoribbons,” New Journal of Physics 12, 103011 (2010). https://doi.org/10.1088/1367-2630/12/10/103011
27.J. Liu, J. Notbohm, R.W. Carpick, and K.T. Turner, “Method for characterizing nanoscale wear of atomic force microscope tips,” ACS Nano, 4, 3763-72 (2010). https://doi.org/10.1021/nn100246g
26.J. Liu, D.S. Grierson, N. Moldovan, J. Notbohm, S. Li, P. Jaroenapibal, S.D. O’Connor, A. V. Sumant, N. Neelakantan, J.A. Carlisle, K.T. Turner, R.W. Carpick, “Preventing nanoscale wear of atomic force microscopy tips through the use of monolithic ultrananocrystalline diamond probes,” Small, 6, 1140-49 (2010).  https://doi.org/10.1002/smll.200901673
25.K.V. Christ, K.B. Williamson, K.S. Masters, and K.T. Turner, “Measurement of single-cell adhesion strength using a microfluidic assay,” Biomedical Microdevices, 12, 443-55 (2010). https://doi.org/10.1007/s10544-010-9401-x
24.K.V. Christ and K.T. Turner, “Methods to measure the strength of cell adhesion to substrates,” Journal of Adhesion Science and Technology, 24, 2027-58 (2010). https://doi.org/10.1163/016942410X507911
23.B.A. Jasperson, Y. Jeon, K.T. Turner, F.E. Pfefferkorn, and W. Qu, “Comparison of micro-pin-fin and microchannel heat sinks considering thermal-hydraulic performance and manufacturability,” IEEE Transactions on Components and Packaging Technologies, 33, 148-60 (2010). https://doi.org/10.1109/tcapt.2009.2023980
22.K.T. Turner, S. Veeraraghavan, and J.K. Sinha, “Predicting distortions and overlay errors due to wafer deformation during chucking on lithography scanners,” Journal of Micro/Nanolithography, MEMS, and MOEMS, 8, 043015 (2009).  https://doi.org/10.1117/1.3247857
21.H.-J. Kim-Lee, D. E. Savage, C. S. Ritz, M. G. Lagally, and K. T. Turner, “Control of three-dimensional island growth with mechanically responsive single-crystal nanomembrane substrates,” Physical Review Letters, 102, 226103 (2009). https://doi.org/10.1103/PhysRevLett.102.226103
20.Y. Mo, K. T. Turner, and I. Szlufarska, “Friction laws at the nanoscale,” Nature, 457 1116-19 (2009). https://doi.org/10.1038/nature07748
19.R. Tadepalli, K.T. Turner, and C.V. Thompson, “Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds,” Acta Materialia, 56, 438-47 (2008).  https://doi.org/10.1016/j.actamat.2007.10.016
18.R. Tadepalli and K.T. Turner, “A chevron specimen for the measurement of mixed-mode interface toughness of wafer bonds,” Engineering Fracture Mechanics, 75, 1310-19 (2008). https://doi.org/10.1016/j.engfracmech.2007.07.009
17.R. Tadepalli, K.T. Turner, and C.V. Thompson, “Mixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test,” Journal of the Mechanics and Physics of Solids, 56, 707-18 (2008). https://doi.org/10.1016/j.jmps.2007.07.016
16.K.T. Turner and S.M. Spearing, “Accurate characterization of wafer bond toughness with the double cantilever specimen,” Journal of Applied Physics, 103, 013514 (2008). https://doi.org/10.1063/1.2828156
15.M.R. Tupek and K.T. Turner, “Sub-micron aligned wafer bonding via capillary forces,” Journal of Vacuum Science and Technology B, 25, 1976-81 (2007). https://doi.org/10.1116/1.2787866
14.M.R. Sogard, A.R. Mikkelson, M. Nataraju, K.T. Turner, and R.L. Engelstad, “Analysis of Coulomb and Johnson-Rahbek electrostatic chuck performance for EUV Lithography” Journal of Vacuum Science and Technology B, 25, 2155-61 (2007). https://doi.org/10.1116/1.2798724
13.J. J. Dyreby, G. F. Nellis, and K.T. Turner, “Simulating fluid flow in lithographically directed, evaporation driven self-assembly systems,” Microelectronic Engineering, 84, 1519-22 (2007). https://doi.org/10.1016/j.mee.2007.01.253
12.M. Puig-De-Morales-Marinkovic, K. T. Turner, J. P. Butler, J. J. Fredberg, and S. Suresh, “Viscoelasticity of the human red blood cell,” American Journal of Physiology-Cell Physiology, 293, C597-605 (2007). https://doi.org/10.1152/ajpcell.00562.2006
11.V. Ramaswamy, R. L. Engelstad, K.T. Turner, A. R. Mikkelson, and S. Veeraraghavan, “Distortion of chucked extreme ultraviolet reticles from entrapped particles,” Journal of Vacuum Science and Technology B, 24, 2829-33 (2006). https://doi.org/10.1116/1.2375078
10.M. Nataraju, J. Sohn, S. Veeraraghavan, A. Mikkelson, K.T. Turner, R. Engelstad, C. Van Peski, and K.J. Orvek, “Electrostatic chucking for extreme ultraviolet lithography: Simulations and experiments,” Journal of Vacuum Science and Technology B, 24, 2834-39 (2006). https://doi.org/10.1116/1.2388967
9.K.T. Turner and S.M. Spearing, “Mechanics of direct wafer bonding,” Proceedings of the Royal Society of London A, 462, 171-88 (2006). https://doi.org/10.1098/rspa.2005.1571   
8.K.T. Turner, S.M. Spearing, W.A. Baylies, M. Robinson, and R. Smythe, “Effect of nanotopography in direct wafer bonding: Modeling and measurements,” IEEE Transactions on Semiconductor Manufacturing, 18, 289-96 (2005). https://doi.org/10.1109/TSM.2005.845009
7.K.T. Turner, M.D. Thouless, and S.M. Spearing, “Mechanics of wafer bonding: Effect of clamping,” Journal of Applied Physics, 95, 349-55 (2004). https://doi.org/10.1063/1.1629776
6.V.T. Srikar, K.T. Turner, T.Y.A. Ie, and S.M. Spearing, “Structural design considerations for micromachined solid-oxide fuel cells,” Journal of Power Sources, 125, 62-9 (2004). https://doi.org/10.1016/j.jpowsour.2003.07.002
5.H.Q. Li, D.C. Roberts, J.L. Steyn, K.T. Turner, O. Yaglioglu, N.W. Hagood, S.M. Spearing, and M.A. Schmidt, “Fabrication of a high frequency piezoelectric microvalve,” Sensors and Actuators A, 111, 51-6 (2004). https://doi.org/10.1016/j.sna.2003.10.013
4.A.A. Ayon, X. Zhang, K.T. Turner, D. Choi, B. Miller, S.F. Nagle, and S.M. Spearing, “Characterization of silicon wafer bonding for power MEMS applications,” Sensors and Actuators A, 103, 1-8 (2003). https://doi.org/10.1016/S0924-4247(02)00329-1
3.K.T. Turner and S.M. Spearing, “Modeling of direct wafer bonding: Effect of wafer bow and etch patterns,” Journal of Applied Physics, 92, 7658-66 (2002). https://doi.org/10.1063/1.1521792
2.D.C. Roberts, H. Li, J. Steyn, K.T. Turner, R. Mlcak, L. Saggere, S.M. Spearing, M.A. Schmidt, and N.W. Hagood, “A high frequency, high stiffness piezoelectric actuator for microhydraulic applications,” Sensors and Actuators A, 97-98, 620-31 (2002). https://doi.org/10.1016/S0924-4247(01)00841-X
1.W.N. Sharpe Jr., K.T. Turner, and R.L. Edwards, “Tensile testing of polysilicon,” Experimental Mechanics, 39, 162-70 (1999). https://doi.org/10.1007/BF02323548

Selected Conference Papers

67.G. Iyer, A.-M. Zaccarin, R. Olsson III, and K.T. Turner, “Fabrication and characterization of cellulose-based materials for biodegradable soil moisture sensors,” in Proceedings of IEEE Sensors 2022 (2022). https://doi.org/10.1109/SENSORS52175.2022.9967089
66.L.M. Mariani, J.M. Considine, and K.T. Turner “Mechanical characterization of cellulose nanofibril materials made by additive manufacturing,” in Mechanics of Additive and Advanced Manufacturing (Society of Experimental Mechanics Annual Meeting, 2018), 8, 43-5 (2019). https://doi.org/10.1007/978-3-319-95083-9_9
65.J. Considine, F. Pierron, and K.T. Turner, “Use of VFM for heterogeneity evaluation of materials under uniaxial tensile stress,” in Experimental and Applied Mechanics (Society of Experimental Mechanics Annual Meeting, 2015), 4, 61-6 (2016) https://doi.org/10.1007/978-3-319-22449-7_7
64.K.T. Turner and N. Ip, “Experimental characterization of adhesion hysteresis in soft elastomer contacts,” in Proceedings of the PSTC Tape Summit (2015). (invited)
63.K.T. Turner and J.K. Sinha, “Effect of wafer geometry on lithography chucking processes,” in Proceedings of SPIE Advanced Lithography Conference, 94240L (2015). https://doi.org/10.1117/12.2085693
62.K.T. Turner, P. Vukkadala, S. Veeraraghavan, and J.K. Sinha, “Monitoring process-induced overlay errors through high-resolution wafer geometry measurements,” in Proceedings of SPIE Advanced Lithography Conference, 905013 (2014). https://doi.org/10.1117/12.2046340
61.J.M. Considine, F. Pierron, K.T. Turner, and D.W. Vahey, “Anisotropy evaluation of paperboard with virtual fields method,” in Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems (Society of Experimental Mechanics Annual Meeting, 2013), 8, 163-70 (2014). https://doi.org/10.1007/978-3-319-00876-9_20
60.M.J. Wald, J.M. Considine, and K.T. Turner, “Indentation measurements on soft materials using optical surface deformation measurements,” in Mechanics of Biological Systems and Materials (Society of Experimental Mechanics Annual Meeting, 2013), 4, 41-51 (2014). https://doi.org/10.1007/978-3-319-00777-9_6
59.K.T. Turner, “Mechanics of wafer bonding and layer transfer processes,” ECS Transactions (2012 ECS Meeting, Semiconductor Wafer Bonding 12: Science, Technology, and Applications), 50, 201-6 (2013). (invited) https://doi.org/10.1149/05007.0201ecst
58.M.J. Wald, J.M. Considine, and K.T. Turner, “Improved instrumented indentation of soft materials through surface deformation measurements,” in Mechanics of Biological Systems and Materials (Society of Experimental Mechanics Annual Meeting, 2012), 5, 141-7 (2013). https://doi.org/10.1007/978-1-4614-4427-5_20
57.J. Liu, D.S. Grierson, K. Sridharan, R.W. Carpick, and K.T. Turner, “Characterizing the wear of diamond-like-carbon atomic force microscope probes,” in Proceedings of 2012 Society of Experimental Mechanics Annual Meeting, 283, (2012).
56.V. Vahdat, D.S. Grierson, K.T. Turner, and R.W. Carpick, “Nano-scale forces, stresses, and tip geometry evolution of amplitude modulation atomic force microscopy probes” in Proceedings of the 2011 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, 54846, 543-9 (2011). https://doi.org/10.1115/DETC2011-48653
55.S. Veeraghaven, K.T. Turner, J. Sinha, “Simulation of non-uniform wafer geometry and thin film residual stress on overlay errors,” in Proceedings of SPIE Advanced Lithography, 7971, 79711U (2011). https://doi.org/10.1117/12.879493
54.K.T. Turner, “Exploiting mechanics to improve wafer bonding and layer transfer processes,” in Proceedings of WaferBond ’11: Conference on Wafer Bonding for Microsystems, 3D, and Wafer Level Integration (2011).
53.D. Melanz, M. Tupy, B. Smith, K.T. Turner, and D. Negrut, “On the validation of a differential variational inequality approach for the dynamics of granular material,” in Proceedings of the 2010 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, 44113, 777-89 (2010). https://doi.org/10.1115/DETC2010-28804
52.N. Podjue, W. Kerr, and K.T. Turner, “Inspection of bonded interfaces using scanning infrared interferometry,” in ECS Transactions (2010 ECS Meeting, Semiconductor Wafer Bonding 11: Science, Technology, and Applications), 33, 537-41 (2010). https://doi.org/10.1149/1.3483545
51.D.S. Grierson and K.T. Turner, “Characterization of hysteresis of surface energy in room-temperature direct bonding processes,” in ECS Transactions (2010 ECS Meeting, Semiconductor Wafer Bonding 11: Science, Technology, and Applications), 33, 573-80 (2010). https://doi.org/10.1149/1.3483549
50.H.J. Kim-Lee and K.T. Turner, “Effect of pattern geometry on the fracture behavior of direct bonded silicon wafers,” in ECS Transactions (2010 ECS Meeting, Semiconductor Wafer Bonding 11: Science, Technology, and Applications), 33, 521-27 (2010). https://doi.org/10.1149/1.3483543
49.J. Liu, D.S. Grierson, K. Sridharan, R.W. Carpick, and K.T. Turner, “Assessment of the mechanical integrity of silicon and diamond-like carbon coated silicon atomic force microscope probes,” in the Proceedings of SPIE – Instrumentation, Metrology, and Standards for Nanomanufacturing IV, 7767, 776708 (2010). https://doi.org/10.1117/12.861789
48.J.T. Decker, A.A. Khaja, M.T. Hoang, J.M. Considine, D.W. Vahey, K.T. Turner and R.E. Rowlands “Variation of paper curl due to fiber orientation,” in Application of Imaging Techniques to Mechanics of Materials and Structures (Society of Experimental Mechanics Annual Meeting, 2010), 4, 347-52 (2013). https://doi.org/10.1007/978-1-4419-9796-8_45
47.J.M. Considine, D.W. Vahey, D. Matthys, R.E. Rowlands, and K.T. Turner, “An inverse method for analyzing defects in heterogeneous materials,” in Application of Imaging Techniques to Mechanics of Materials and Structures (Society of Experimental Mechanics Annual Meeting, 2010), 4, 339-46 (2013). https://doi.org/10.1007/978-1-4419-9796-8_44
46.M.J. Wald, J.M. Considine, and K.T. Turner, “Measuring the elastic modulus of soft thin films on substrates,” in Experimental and Applied Mechanics (Society of Experimental Mechanics Annual Meeting, 2010), 6, 741-47 (2011). https://doi.org/10.1007/978-1-4419-9792-0_105
45.B.A. Jasperson, F.E. Pfefferkorn, W. Qu, and K.T. Turner, “A thin-film heat flux sensor fabricated on copper for heat transfer measurements in parallel channel heat sinks,” in Proceedings of the 5th International Conference on Micromanufacturing, 437-44 (2010). http://digital.library.wisc.edu/1793/65527 
44.B. Smith, D.M. Wolf, K.T. Turner, N.A. Duffie, X. Li, and F.E. Pfefferkorn, “Laser polishing of micro-machined microfluidic molds,” in Proceedings of the 5th International Conference on Micromanufacturing, 445-51(2010).  http://digital.library.wisc.edu/1793/65521
43.K.V. Christ, B.B. Smith, F.E. Pfefferkorn, and K.T. Turner, “Micro end milling polystyrene for microfluidic applications,” in Proceedings of the 5th International Conference on Micromanufacturing, 423-30 (2010).  http://digital.library.wisc.edu/1793/65525
42.K.V. Christ and K.T. Turner, “Hydrodynamically-confined microflows for cell adhesion strength measurement,” in Proceedings of ASME 2010 First Global Congress on NanoEngineering for Medicine and Biology, 43925, 113-4 (2010). https://doi.org/10.1115/NEMB2010-13007
41.R.A. Allen, W. Baylies, P. Langer, R. Danzi, F. Delrio, G. Horn, R. Knechtel, M. Mattes, D. Read, S. Sood, and K.T. Turner, “A round robin experiment to provide precision and bias for SEMI MS5: Test method for wafer bond strength measurements using micro-chevron test structures,” in Proceedings of WaferBond ’09: Workshop on Wafer Bonding for MEMS Technologies (2009).
40.W. Kerr, N. Podjue, and K.T. Turner, “Inspection of bonded interfaces using scanning infrared interferometry,” in Proceedings of WaferBond ’09: Workshop on Wafer Bonding for MEMS Technologies (2009).
39.C.A. Konishi, W. Qu, B.A. Jasperson, F.E. Pfefferkorn, and K.T. Turner, “Experimental study of adiabatic water liquid-vapor two-phase pressure drop across an array of staggered micro-pin-fins,” in Proceedings of the ASME International Mechanical Engineering Congress and Exposition – IMECE 2008, 48715, 1597-1605 (2008). https://doi.org/10.1115/IMECE2008-69051
38.R.L. Engelstad, J. Sohn, J.R. Zeuske, V.S. Battula, P. Vukkadala, C.K. Van Peski, K.J. Orvek, K.T. Turner, A.R. Mikkelson, and M. Nataraju, “Status of EUVL reticle chucking,” in Proceedings of the24th European Mask and Lithography Conference, 6792, 67920X (2008). https://doi.org/10.1117/12.798937
37.B.T. Hotle, J.M. Considine, M.J. Wald, R.E. Rowlands, and K.T. Turner, “Effects of thermal aging on the mechanical performance of paper,” in Proceedings of the 2008 Progress in Paper Physics Seminar, 315-8 (2008).
36.B.F. West, B.T. Hotle, J.E. Jakes, J.M. Considine, R.E. Rowlands, and KT Turner, “Nanoindentation studies of paper,” in Proceedings of the 2008 Progress in Paper Physics Seminar, 163-8 (2008).
35.B.T. Hotle, J.M. Considine, M.J. Wald, R.E. Rowlands, and K.T. Turner, “Effects of thermal aging on mechanical performance of paper,” in Proceedings of 2008 Society of Experimental Mechanics Annual Meeting, 1790-8 (2008).
34.R.A. Allen, J.C. Marshall, W.A. Baylies, D.T. Read, F. Delrio, K.T. Turner, M. Bernasch, and J. Bagdahn, “A standard Method for measuring wafer bond strength for MEMS applications,” in ECS Transactions (2008 ECS Meeting, Semiconductor Wafer Bonding 10: Science, Technology, and Applications), 16(8), 449-55 (2008). https://doi.org/10.1149/1.2982899
33.H.-J. Kim-Lee, D.E. Savage, C.S. Ritz, M.G. Lagally, and K.T. Turner, “Engineering SiGe growth using mechanically responsive ultrathin substrates,” in ECS Transactions (2008 ECS Meeting, SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices), 16(10), 299-305 (2008). https://doi.org/10.1149/1.2986787
32.K.T. Turner, “Fabricating strained silicon substrates using mechanical deformation during wafer bonding,” in ECS Transactions (2008 ECS Meeting, Semiconductor Wafer Bonding 10: Science, Technology, and Applications), 16, 321-8 (2008). https://doi.org/10.1149/1.2982884
31.J. Dyreby, K.T. Turner, and G.F. Nellis, “Simulating droplet dynamics during evaporation-driven self-assembly,” in Proceedings of the SPIE – Emerging Lithographic Technologies XI, 6517, 651738 (2007). https://doi.org/10.1117/12.720620
30.M. Nataraju, J. Sohn, A.R. Mikkelson, R.L. Engelstad, K.T. Turner, C.K. Van Peski, and K.J. Orvek, “Electrostatic Chucking of EUVL Reticles,” in Proceedings of the SPIE – Emerging Lithographic Technologies XI, 6517, 65170Y (2007). https://doi.org/10.1117/12.720621
29.R.L. Engelstad, J. Sohn, A.R. Mikkelson, M. Nataraju, and K.T. Turner, “Compensating for image placement errors induced during the fabrication and chucking of EUVL masks,” in Proceedings of SPIE – Photomask Technology 2007, 6730, 673004 (2007). https://doi.org/10.1117/12.752601
28.R.L. Engelstad, K.T. Turner, M. Nataraju, J. Sohn, A.R. Mikkelson, V.S. Battula, P. Vukkadala, J.R. Zeuske, and C.K. Van Peski, “Measuring and characterizing the nonflatness of EUVL reticles and electrostatic chucks,” in Proceedings of SPIE – Photomask Technology 2007, 6730, 673014 (2007). https://doi.org/10.1117/12.746842
27.S. Veeraraghavan, J. Sohn, K.T. Turner, “Techniques to measure force uniformity of electrostatic chucks for EUV mask clamping,” in Proceedings of SPIE – Photomask Technology 2007, 6730, 67305G (2007). https://doi.org/10.1117/12.746843
26.K.V. Christ, K. B. Williamson, K.S. Masters, and K.T. Turner, “Characterization of the effect of geometry on single cell adhesion strength using a microfluidic device,” in Proceedings of the ASME International Mechanical Engineering Congress and Exposition (IMECE 2007), 43041, 809-10 (2007). https://doi.org/10.1115/IMECE2007-43775
25.R. Tadepalli, C.V. Thompson, and K.T. Turner, “Measurement of mixed-mode fracture properties of Cu-Cu bonds using an asymmetric chevron specimen,” in Proceedings of Conference on Wafer Bonding for MEMS Technologies and Wafer-Level Integration (2007).
24.H.-J. Kim-Lee, M.R. Tupek, and K.T. Turner, “Capillary assisted alignment for high density wafer-level integration,” in Proceedings of Conference on Wafer Bonding for MEMS Technologies and Wafer-Level Integration (2007).
23.J. Dyreby, G.F. Nellis, and K.T. Turner, “Modeling evaporation driven self-assembly systems for magnetic storage arrays,” in Materials Research Society (MRS) Online Proceedings Library, 961 (2006). https://doi.org/10.1557/PROC-0961-O16-05
22.M. Nataraju, J. Sohn, A. Mikkelson, K.T. Turner, R. Engelstad, C. Van Peski, “EUV mask and chuck analysis: Simulation and experimentation,” in Proceedings of SPIE – Emerging Lithographic Technologies X, 6151, 61510C (2006). https://doi.org/10.1117/12.657154
21.K.T. Turner, “Mechanics models for the design of wafer bonding tools,” in Proceedings of 2nd Workshop on Wafer Bonding for MEMS Technologies (2006).
20.V. Ramaswamy, K. T. Turner, R. L. Engelstad, and E. G. Lovell, “Predicting the influence of trapped particles on EUVL reticle distortion during exposure chucking,” in Proceedings of SPIE – Photomask Technology 2006, 6349, 634938 (2006). https://doi.org/10.1117/12.686145
19.J. Sohn, S. Veeraraghavan, K.T. Turner, R.L. Engelstad, and C. K. Van Peski, “Measuring force uniformity during electrostatic chucking of EUVL masks,” in Proceedings of SPIE – Photomask Technology 2006, 6349, 63493B (2006). https://doi.org/10.1117/12.686282
18. M. Nataraju, J. Sohn, A.R. Mikkelson, K.T. Turner, R.L. Engelstad, and C.K. Van Peski, “Experimental verification of finite element model prediction of EUVL mask flatness during electrostatic chucking,” in Proceedings of SPIE – Photomask Technology 2006, 6349, 634939 (2006). https://doi.org/10.1117/12.686153
17.K.T. Turner and S.M. Spearing, “Mechanical aspects of wafer bonding” in Semiconductor Wafer Bonding VIII: Science, Technology, and Applications (2005 ECS Meeting), PV 2005-02, 241-52 (2005). (invited)
16.K.T. Turner, S.M. Spearing, P. Hester, J. Sinha, and W.A. Baylies, “Effect of wafer-scale shape variations and mounting in wafer bonding,” in Semiconductor Wafer Bonding VIII: Science, Technology, and Applications (2005 ECS Meeting), PV 2005-02, 270-9 (2005).
15.K.T. Turner and S.M. Spearing, “Experimental validation of mechanics-based process models for direct wafer bonding,” in Technical Digest of Hilton Head ’04: Solid-State Sensor, Actuator, and Microsystems Workshop, 196-9 (2004). https://doi.org/10.31438/trf.hh2004.53
14.H.Q. Li, D.C. Roberts, J.L. Steyn, K.T. Turner, O. Yaglioglu, N.W. Hagood, S.M. Spearing, and M.A. Schmidt, “Fabrication of a microvalve with piezoelectric actuation,” in Proceedings of the Sixteenth Annual International Conference on Micro Electro Mechanical Systems (MEMS), 2003, 92-5 (2003). https://doi.org/10.1109/memsys.2003.1189695
13.K.T. Turner and S.M. Spearing, “Role of wafer bow and etch patterns in direct wafer bonding,” in Semiconductor Wafer Bonding VII: Science, Technology, and Applications (2003 ECS Meeting), PV 2003-19, 166-74 (2003).
12.K.T. Turner and S.M. Spearing, “Mechanics of direct wafer bonding,” in Proceedings of the ASME 2003 International Mechanical Engineering Congress and Exposition, Microelectromechanical Systems (MEMS), 163-8 (2003). https://doi.org/10.1115/IMECE2003-42106
11.K.T. Turner and S.M. Spearing, “Measurement of the work of adhesion on wafers for direct bonding,” in Materials Research Society (MRS) Online Proceedings Library, 782, 124 (2003). https://doi.org/10.1557/PROC-782-A12.4
10.A.A. Ayon, X. Zhang, K.T. Turner, D. Choi, B. Miller, S. Nagle, and S.M. Spearing, “Low temperature silicon wafer bonding for MEMS applications,” in Proceedings of the Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 411-4 (2002). https://doi.org/10.1109/memsys.2002.984290
9.J.L. Steyn, H.Q. Li, D.C. Roberts, K.T. Turner, O. Yaglioglu, Y.-H. Su, M.A. Schmidt, S.M. Spearing, and N.W. Hagood, “Hydraulic amplification devices for microscale actuation,” in Technical Digest of Hilton Head ’02: Solid-State Sensor and Actuator Workshop, 50-3 (2002). https://doi.org/10.31438/trf.hh2002.13
8.K.T. Turner, R. Mlcak, D.C. Roberts and S.M. Spearing, “Bonding of bulk piezoelectric material to silicon using a gold tin eutectic bond,” in Materials Research Society (MRS) Online Proceedings Library, 687, 32 (2001). https://doi.org/10.1557/PROC-687-B3.2
7.D.C. Roberts, J.L. Steyn, H. Li, K.T. Turner, R. Mlcak, L. Saggere, S.M. Spearing, M.A. Schmidt, and N.W. Hagood, “A high-frequency, high-stiffness piezoelectric micro-actuator for hydraulic applications,” in Transducers ’01 (Eurosensors XV): 11th International Conference Solid State Sensors and Actuators, 686-9 (2001). https://doi.org/10.1007/978-3-642-59497-7_163
6.K.T. Turner, A.A. Ayon, D. Choi, B. Miller, and S.M. Spearing, “Characterization of silicon fusion bonds using a four-point bend specimen,” in Materials Research Society (MRS) Online Proceedings Library, 657, 63 (2000). https://doi.org/10.1557/PROC-657-EE6.3
5.L. Saggere, N.W. Hagood, D.C. Roberts, H.Q. Li, J.L. Steyn, K. Turner, J.A. Carretero, O. Yaglioglu, Y.-H. Su, R. Mlcak, S.M. Spearing, K.S. Breuer, and M.A. Schmidt, “Design, fabrication and testing of a piezoelectrically driven high flow-rate micro-pump,” in Proceedings of the 2000 12th IEEE International Symposium on Applications of Ferroelectrics, 297-300 (2000). https://doi.org/10.1109/ISAF.2000.941559
4.H.Q. Li, D.C. Roberts, J.L. Steyn, K.T. Turner, J.A. Carretero, O. Yaglioglu, Y.-H. Su, R. Mlcak, S.M. Spearing, M.A. Schmidt, R. Mlcak, and K.S. Breuer, “A high frequency high flow rate piezoelectrically driven MEMS micropump,” in Technical Digest of Hilton Head ’00: Solid-State Sensor and Actuator Workshop, 69-72 (2000). https://doi.org/10.31438/trf.hh2000.17
3.W.N. Sharpe Jr. and K.T. Turner, “Fatigue testing of materials used in microelectromechanical systems,” in Proceedings of the 7th International Fatigue Congress (Fatigue ’99), 1837-44 (1999).
2.W.N. Sharpe Jr., K. Turner, and R.L. Edwards, “Electrostatic mechanical testing of polysilicon,” in Proceedings of ASME Microelectromechanical Systems (MEMS), 385-8 (1998).
1.W.N. Sharpe Jr., K. Turner, and R.L. Edwards, “Polysilicon tensile testing with electrostatic gripping,” in Materials Research Society (MRS) Proceedings, 518, 191-6 (1998). https://doi.org/10.1557/PROC-518-191 

Books and Book Chapters

4.T. Pardoen, K.T. Turner, M.K. Budzik, “Architected adhesive joints with improved fracture toughness,” Advances in Structural Adhesive Bonding, 2nd Ed. Elsevier (2023).
3.C. Park and K.T. Turner, “Design of hydrodynamically confined microfluidic systems,” in Open-Space Microfluidics. Eds. Emmanuel Delamarche and Govind V. Kaigala.  Wiley.  (2018).
2.T.D.B. Jacobs, C.M. Mate, K.T. Turner, and R.W. Carpick, “Understanding the tip-sample contact: An overview of contact mechanics at the nanoscale.” in Scanning Probe Microscopy for Industrial Applications: Nanomechanical Characterization. Ed. D. G. Yablon. Wiley. (2013).
1.Microelectromechanical Systems — Materials and Devices III. Eds. J. Bagdahn, N. Sheppard, K.T. Turner, S. Vengallatore, Materials Research Society (2010).